CPU Comparison

A

AMD

AMD

AMD Ryzen 9 9955HX3D

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Core i9-9900K

CORE STATE Coffee Lake-R

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.6 Base / 5 GHz Turbo

CACHE 16 MB (shared)

MAX TDP 95W

ARCHITECTURE Coffee Lake

nm

PROCESS 14 nm

LAUNCH DATE 2018

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

5,289

1,555

cinebench_cinebench_r15_singlecore

746

219

cinebench_cinebench_r20_multicore

22,039

6,480

cinebench_cinebench_r20_singlecore

3,111

914

cinebench_cinebench_r23_multicore

52,475

15,429

cinebench_cinebench_r23_singlecore

7,408

2,178

passmark_data_compression

762,606

283,506

passmark_data_encryption

38,516

6,430

passmark_extended_instructions

60,405

18,965

passmark_find_prime_numbers

521

47

passmark_floating_point_math

140,559

41,036

passmark_integer_math

219,084

66,134

passmark_multithread

61,403

18,153

passmark_physics

4,653

934

passmark_random_string_sorting

81,627

36,238

passmark_single_thread

4,492

2,919

passmark_singlethread

4,492

2,919

geekbench_multicore

N/A

8,050

geekbench_singlecore

N/A

1,702

DETAILED SPECIFICATIONS

SPECIFICATION

9 9955HX3D

i9-9900K

Core Specs

Cores

16

8 -50.0%

Threads

32

16 -50.0%

Base Clock (GHz)

2.5

3.6 +44.0%

Boost Clock (GHz)

5.4

5 -7.4%

Frequency (GHz)

2.5

3.6 +44.0%

Turbo Clock (GHz)

5.4

5 -7.4%

Multiplier

25

36 +44.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

64 KB (per core)

L2 Cache

1 MB (per core)

256 KB (per core)

L3 Cache

128 MB (shared)

16 MB (shared)

Power

TDP (W)

55

95 +72.7%

PL1

—

95 W

PL2

—

119 W

PPT

74-101 W

—

Configurable TDP

75 W

—

Architecture

Architecture

Zen 5

Coffee Lake

Codename

Fire Range

Coffee Lake-R

Generation

Ryzen 9 (Zen 5 (Fire Range))

Core i9 (Coffee Lake Refresh)

Process Size

4 nm

14 nm

Transistors

16,630 million

—

Die Size

2x 70.6 mm²

180.3 mm²

Foundry

TSMC

Intel

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

89.6 GB/s

42.7 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket FL1

Intel Socket 1151

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 3, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

UHD Graphics 630

Other

Market

Mobile

Desktop

Production Status

Active

End-of-life

Launch Price

—

$488

Part Number

100-000001030

SRG19SRELS

Package

µFC-BGAFL1

FC-LGA14C

Tj Max

100°C

100°C

Bundled Cooler

None

—

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