CPU Comparison

A

AMD

AMD

AMD Ryzen 9 9955HX3D

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Core i9-11980HK

CORE STATE Tiger Lake-H

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 2.6 Base / 5 GHz Turbo

CACHE 24 MB (shared)

MAX TDP 45W

ARCHITECTURE Tiger Lake

nm

PROCESS 10 nm

LAUNCH DATE 2021

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

5,289

1,922

cinebench_cinebench_r15_singlecore

746

271

cinebench_cinebench_r20_multicore

22,039

8,011

cinebench_cinebench_r20_singlecore

3,111

1,131

cinebench_cinebench_r23_multicore

52,475

19,076

cinebench_cinebench_r23_singlecore

7,408

2,693

passmark_data_compression

762,606

266,571

passmark_data_encryption

38,516

13,813

passmark_extended_instructions

60,405

17,654

passmark_find_prime_numbers

521

100

passmark_floating_point_math

140,559

46,262

passmark_integer_math

219,084

78,682

passmark_multithread

61,403

22,436

passmark_physics

4,653

1,112

passmark_random_string_sorting

81,627

31,709

passmark_single_thread

4,492

3,261

passmark_singlethread

4,492

3,261

DETAILED SPECIFICATIONS

SPECIFICATION

9 9955HX3D

i9-11980HK

Core Specs

Cores

16

8 -50.0%

Threads

32

16 -50.0%

Base Clock (GHz)

2.5

2.6 +4.0%

Boost Clock (GHz)

5.4

5 -7.4%

Frequency (GHz)

2.5

2.6 +4.0%

Turbo Clock (GHz)

5.4

5 -7.4%

Multiplier

25

26 +4.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1.25 MB (per core)

L3 Cache

128 MB (shared)

24 MB (shared)

Power

TDP (W)

55

45 -18.2%

PPT

74-101 W

—

Configurable TDP

75 W

—

Architecture

Architecture

Zen 5

Tiger Lake

Codename

Fire Range

Tiger Lake-H

Generation

Ryzen 9 (Zen 5 (Fire Range))

Core i9 (Tiger Lake-H)

Process Size

4 nm

10 nm

Transistors

16,630 million

—

Die Size

2x 70.6 mm²

190 mm²

Foundry

TSMC

Intel

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

89.6 GB/s

51.2 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket FL1

Intel BGA 1787

Chipsets

—

QM580, HM570, WM590

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 4, 20 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

UHD Graphics 750

Other

Market

Mobile

Mobile

Production Status

Active

End-of-life

Launch Price

—

$583

Part Number

100-000001030

SRKSZ

Package

µFC-BGAFL1

FC-BGA16F

Tj Max

100°C

100°C

Bundled Cooler

None

—

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