CPU Comparison

A

AMD

AMD

AMD Ryzen 9 9955HX3D

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Core i9-11900

CORE STATE Rocket Lake

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 2.5 Base / 5.2 GHz Turbo

CACHE 16 MB (shared)

MAX TDP 65W

ARCHITECTURE Rocket Lake

nm

PROCESS 14 nm

LAUNCH DATE 2021

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

5,289

1,924

cinebench_cinebench_r15_singlecore

746

271

cinebench_cinebench_r20_multicore

22,039

8,019

cinebench_cinebench_r20_singlecore

3,111

1,131

cinebench_cinebench_r23_multicore

52,475

19,093

cinebench_cinebench_r23_singlecore

7,408

2,695

passmark_data_compression

762,606

285,159

passmark_data_encryption

38,516

13,942

passmark_extended_instructions

60,405

19,654

passmark_find_prime_numbers

521

63

passmark_floating_point_math

140,559

48,948

passmark_integer_math

219,084

83,893

passmark_multithread

61,403

22,456

passmark_physics

4,653

977

passmark_random_string_sorting

81,627

33,054

passmark_single_thread

4,492

3,373

passmark_singlethread

4,492

3,373

DETAILED SPECIFICATIONS

SPECIFICATION

9 9955HX3D

i9-11900

Core Specs

Cores

16

8 -50.0%

Threads

32

16 -50.0%

Base Clock (GHz)

2.5

2.5 0.0%

Boost Clock (GHz)

5.4

5.2 -3.7%

Frequency (GHz)

2.5

2.5 0.0%

Turbo Clock (GHz)

5.4

5.2 -3.7%

Multiplier

25

25 0.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

64 KB (per core)

L2 Cache

1 MB (per core)

512 KB (per core)

L3 Cache

128 MB (shared)

16 MB (shared)

Power

TDP (W)

55

65 +18.2%

PPT

74-101 W

—

Configurable TDP

75 W

—

Architecture

Architecture

Zen 5

Rocket Lake

Codename

Fire Range

Rocket Lake

Generation

Ryzen 9 (Zen 5 (Fire Range))

Core i9 (Rocket Lake-S)

Process Size

4 nm

14 nm

Transistors

16,630 million

—

Die Size

2x 70.6 mm²

276 mm²

Foundry

TSMC

Intel

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

89.6 GB/s

51.2 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket FL1

Intel Socket 1200

Chipsets

—

H510, B560, H570, Q570, W580, Z590, Q470, H470, W480, Z490

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 4, 20 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

UHD Graphics 750

Other

Market

Mobile

Desktop

Production Status

Active

End-of-life

Launch Price

—

$439

Part Number

100-000001030

SRKNJ

Package

µFC-BGAFL1

FC-LGA14A

Tj Max

100°C

100°C

Bundled Cooler

None

—

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