CPU Comparison

A

AMD

AMD

AMD Ryzen 9 9955HX3D

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Core i7-8700K

CORE STATE Coffee Lake

CORE SPECS 6 Cores / 12 Threads

CLOCK SPEED 3.7 Base / 4.7 GHz Turbo

CACHE 12 MB (shared)

MAX TDP 95W

ARCHITECTURE Coffee Lake

nm

PROCESS 14 nm

LAUNCH DATE 2017

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

5,289

1,163

cinebench_cinebench_r15_singlecore

746

164

cinebench_cinebench_r20_multicore

22,039

4,846

cinebench_cinebench_r20_singlecore

3,111

684

cinebench_cinebench_r23_multicore

52,475

11,539

cinebench_cinebench_r23_singlecore

7,408

1,629

passmark_data_compression

762,606

198,951

passmark_data_encryption

38,516

4,776

passmark_extended_instructions

60,405

13,514

passmark_find_prime_numbers

521

39

passmark_floating_point_math

140,559

28,538

passmark_integer_math

219,084

45,892

passmark_multithread

61,403

13,576

passmark_physics

4,653

811

passmark_random_string_sorting

81,627

25,270

passmark_single_thread

4,492

2,720

passmark_singlethread

4,492

2,720

geekbench_multicore

N/A

6,535

geekbench_singlecore

N/A

1,616

DETAILED SPECIFICATIONS

SPECIFICATION

9 9955HX3D

i7-8700K

Core Specs

Cores

16

6 -62.5%

Threads

32

12 -62.5%

Base Clock (GHz)

2.5

3.7 +48.0%

Boost Clock (GHz)

5.4

4.7 -13.0%

Frequency (GHz)

2.5

3.7 +48.0%

Turbo Clock (GHz)

5.4

4.7 -13.0%

Multiplier

25

37 +48.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

64 KB (per core)

L2 Cache

1 MB (per core)

256 KB (per core)

L3 Cache

128 MB (shared)

12 MB (shared)

Power

TDP (W)

55

95 +72.7%

PPT

74-101 W

—

Configurable TDP

75 W

—

Architecture

Architecture

Zen 5

Coffee Lake

Codename

Fire Range

Coffee Lake

Generation

Ryzen 9 (Zen 5 (Fire Range))

Core i7 (Coffee Lake)

Process Size

4 nm

14 nm

Transistors

16,630 million

—

Die Size

2x 70.6 mm²

154 mm²

Foundry

TSMC

Intel

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

89.6 GB/s

42.7 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket FL1

Intel Socket 1151

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 3, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

UHD Graphics 630

Other

Market

Mobile

Desktop

Production Status

Active

End-of-life

Launch Price

—

$359

Part Number

100-000001030

SR3QRQNMK

Package

µFC-BGAFL1

FC-LGA1151

Tj Max

100°C

—

Bundled Cooler

None

—

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