CPU Comparison

AMD
AMD

AMD Ryzen 9 9955HX3D

CORE STATE Fire Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.5 Base / 5.4 GHz Turbo
CACHE 128 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025
VS
Intel
INTEL

Core i5-11500

CORE STATE Rocket Lake
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 2.7 Base / 4.6 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 65W
ARCHITECTURE Rocket Lake
nm
PROCESS 14 nm
LAUNCH DATE 2021

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
5,289
1,465
cinebench_cinebench_r15_singlecore
746
206
cinebench_cinebench_r20_multicore
22,039
6,106
cinebench_cinebench_r20_singlecore
3,111
861
cinebench_cinebench_r23_multicore
52,475
14,540
cinebench_cinebench_r23_singlecore
7,408
2,052
passmark_data_compression
762,606
210,796
passmark_data_encryption
38,516
10,592
passmark_extended_instructions
60,405
15,111
passmark_find_prime_numbers
521
51
passmark_floating_point_math
140,559
34,422
passmark_integer_math
219,084
58,352
passmark_multithread
61,403
17,107
passmark_physics
4,653
823
passmark_random_string_sorting
81,627
24,505
passmark_single_thread
4,492
3,131
passmark_singlethread
4,492
3,131

DETAILED SPECIFICATIONS

SPECIFICATION
9 9955HX3D
i5-11500
Core Specs
Cores
16
6 -62.5%
Threads
32
12 -62.5%
Base Clock (GHz)
2.5
2.7 +8.0%
Boost Clock (GHz)
5.4
4.6 -14.8%
Frequency (GHz)
2.5
2.7 +8.0%
Turbo Clock (GHz)
5.4
4.6 -14.8%
Multiplier
25
27 +8.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
128 MB (shared)
12 MB (shared)
Power
TDP (W)
55
65 +18.2%
PPT
74-101 W
Configurable TDP
75 W
Architecture
Architecture
Zen 5
Rocket Lake
Codename
Fire Range
Rocket Lake
Generation
Ryzen 9 (Zen 5 (Fire Range))
Core i5 (Rocket Lake-S)
Process Size
4 nm
14 nm
Transistors
16,630 million
Die Size
2x 70.6 mm²
276 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
51.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket FL1
Intel Socket 1200
Chipsets
H510, B560, H570, Q570, W580, Z590, Q470, H470, W480, Z490
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Graphics
Integrated Graphics
Radeon 610M
UHD Graphics 750
Other
Market
Mobile
Desktop
Production Status
Active
End-of-life
Launch Price
$192
Part Number
100-000001030
SRKNY
Package
µFC-BGAFL1
FC-LGA14A
Tj Max
100°C
100°C
Bundled Cooler
None
View Ryzen 9 9955HX3D Details View Core i5-11500 Details