CPU Comparison

A

AMD

AMD

AMD Ryzen 9 9955HX3D

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

A

AMD

AMD

Ryzen AI Max PRO 390

CORE STATE Strix Halo

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.2 Base / 5 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

5,289

3,700

cinebench_cinebench_r15_singlecore

746

522

cinebench_cinebench_r20_multicore

22,039

15,418

cinebench_cinebench_r20_singlecore

3,111

2,176

cinebench_cinebench_r23_multicore

52,475

36,710

cinebench_cinebench_r23_singlecore

7,408

5,182

passmark_data_compression

762,606

505,322

passmark_data_encryption

38,516

26,115

passmark_extended_instructions

60,405

40,687

passmark_find_prime_numbers

521

333

passmark_floating_point_math

140,559

96,002

passmark_integer_math

219,084

150,375

passmark_multithread

61,403

43,189

passmark_physics

4,653

2,769

passmark_random_string_sorting

81,627

55,663

passmark_single_thread

4,492

3,997

passmark_singlethread

4,492

3,997

DETAILED SPECIFICATIONS

SPECIFICATION

9 9955HX3D

AI Max PRO 390

Core Specs

Cores

16

12 -25.0%

Threads

32

24 -25.0%

Base Clock (GHz)

2.5

3.2 +28.0%

Boost Clock (GHz)

5.4

5 -7.4%

Frequency (GHz)

2.5

3.2 +28.0%

Turbo Clock (GHz)

5.4

5 -7.4%

Multiplier

25

32 +28.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

128 MB (shared)

64 MB (shared)

Power

TDP (W)

55

55 0.0%

PPT

74-101 W

—

Configurable TDP

75 W

45-120 W

Architecture

Architecture

Zen 5

Zen 5

Codename

Fire Range

Strix Halo

Generation

Ryzen 9 (Zen 5 (Fire Range))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

4 nm

4 nm

Transistors

16,630 million

—

Die Size

2x 70.6 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

89.6 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket FL1

AMD Socket FP11

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

Radeon 610M

Radeon 8050S

Other

Market

Mobile

Mobile

Production Status

Active

Active

Part Number

100-000001030

100-000001421

Package

µFC-BGAFL1

FC-BGA

Tj Max

100°C

100°C

Bundled Cooler

None

—

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