CPU Comparison

A

AMD

AMD

AMD Ryzen 9 9955HX3D

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

A

AMD

AMD

Ryzen AI 7 350

CORE STATE Krackan Point

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 2000 Base / 5 GHz Turbo

CACHE 8 MB

MAX TDP 28W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

5,289

2,095

cinebench_cinebench_r15_singlecore

746

295

cinebench_cinebench_r20_multicore

22,039

8,731

cinebench_cinebench_r20_singlecore

3,111

1,232

cinebench_cinebench_r23_multicore

52,475

20,790

cinebench_cinebench_r23_singlecore

7,408

2,935

passmark_data_compression

762,606

295,805

passmark_data_encryption

38,516

14,954

passmark_extended_instructions

60,405

21,020

passmark_find_prime_numbers

521

77

passmark_floating_point_math

140,559

52,547

passmark_integer_math

219,084

85,686

passmark_multithread

61,403

24,506

passmark_physics

4,653

1,328

passmark_random_string_sorting

81,627

32,301

passmark_single_thread

4,492

3,910

passmark_singlethread

4,492

3,910

DETAILED SPECIFICATIONS

SPECIFICATION

9 9955HX3D

AI 7 350

Core Specs

Cores

16

8 -50.0%

Threads

32

16 -50.0%

Base Clock (GHz)

2.5

2,000 +79900.0%

Boost Clock (GHz)

5.4

5 -7.4%

Frequency (GHz)

2.5

2,000 +79900.0%

Turbo Clock (GHz)

5.4

5 -7.4%

Multiplier

25

20 -20.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

128 MB (shared)

8 MB

Power

TDP (W)

55

28 -49.1%

PPT

74-101 W

—

Configurable TDP

75 W

15-54 W

Architecture

Architecture

Zen 5

Zen 5

Codename

Fire Range

Krackan Point

Generation

Ryzen 9 (Zen 5 (Fire Range))

Ryzen AI (Zen 5)

Process Size

4 nm

4 nm

Transistors

16,630 million

—

Die Size

2x 70.6 mm²

195 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

DDR5, LPDDR5X

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

89.6 GB/s

89.6 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket FL1

AMD Socket FP8

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

—

4 + 4

E-Core Frequency

—

2000 MHz up to 3.5 GHz

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

Radeon 610M

Radeon 860M

Other

Market

Mobile

Mobile

Production Status

Active

Active

Part Number

100-000001030

100-000001601

Package

µFC-BGAFL1

FP8

Tj Max

100°C

100°C

Bundled Cooler

None

—

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