CPU Comparison

AMD
AMD

AMD Ryzen 9 8945HX

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.5 Base / 5.4 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025
VS
AMD
AMD

Ryzen 9 9955HX3D

CORE STATE Fire Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.5 Base / 5.4 GHz Turbo
CACHE 128 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
4,305
5,289
cinebench_cinebench_r15_singlecore
607
746
cinebench_cinebench_r20_multicore
17,939
22,039
cinebench_cinebench_r20_singlecore
2,532
3,111
cinebench_cinebench_r23_multicore
42,713
52,475
cinebench_cinebench_r23_singlecore
6,030
7,408
passmark_data_compression
646,896
762,606
passmark_data_encryption
39,600
38,516
passmark_extended_instructions
47,600
60,405
passmark_find_prime_numbers
267
521
passmark_floating_point_math
118,280
140,559
passmark_integer_math
198,352
219,084
passmark_multithread
50,251
61,403
passmark_physics
2,027
4,653
passmark_random_string_sorting
74,420
81,627
passmark_single_thread
3,963
4,492
passmark_singlethread
3,963
4,492

DETAILED SPECIFICATIONS

SPECIFICATION
9 8945HX
9 9955HX3D
Core Specs
Cores
16
16 0.0%
Threads
32
32 0.0%
Base Clock (GHz)
2.5
2.5 0.0%
Boost Clock (GHz)
5.4
5.4 0.0%
Frequency (GHz)
2.5
2.5 0.0%
Turbo Clock (GHz)
5.4
5.4 0.0%
Multiplier
24
25 +4.2%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
64 MB (shared)
128 MB (shared)
Power
TDP (W)
55
55 0.0%
PPT
74-101 W
Configurable TDP
45-75 W
75 W
Architecture
Architecture
Zen 4
Zen 5
Codename
Dragon Range
Fire Range
Generation
Ryzen 9 (Zen 4 (Dragon Range))
Ryzen 9 (Zen 5 (Fire Range))
Process Size
5 nm
4 nm
Transistors
13,140 million
16,630 million
Die Size
2x 71 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
83.2 GB/s
89.6 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket FL1
AMD Socket FL1
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
6 nm
Graphics
Integrated Graphics
Radeon 610M
Radeon 610M
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000001848
100-000001030
Package
µFC-BGAFL1
µFC-BGAFL1
Tj Max
100°C
100°C
Bundled Cooler
None
View Ryzen 9 8945HX Details View Ryzen 9 9955HX3D Details