CPU Comparison
AMD
AMD Ryzen 7 7730U
CORE STATE
Barcelo-R
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
2000 Base / 4.5 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
15W
ARCHITECTURE
Zen 3
PROCESS
7 nm
LAUNCH DATE
2023
VS
AMD
Ryzen 9 9955HX3D
CORE STATE
Fire Range
CORE SPECS
16 Cores / 32 Threads
CLOCK SPEED
2.5 Base / 5.4 GHz Turbo
CACHE
128 MB (shared)
MAX TDP
55W
ARCHITECTURE
Zen 5
PROCESS
4 nm
LAUNCH DATE
2025
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
7 7730U
9 9955HX3D
Core Specs
Cores
8
16
+100.0%
Threads
16
32
+100.0%
Base Clock (GHz)
2,000
2.5
-99.9%
Boost Clock (GHz)
4.5
5.4
+20.0%
Frequency (GHz)
2,000
2.5
-99.9%
Turbo Clock (GHz)
4.5
5.4
+20.0%
Multiplier
20
25
+25.0%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
16 MB (shared)
128 MB (shared)
Power
TDP (W)
15
55
+266.7%
PPT
—
74-101 W
Configurable TDP
—
75 W
Architecture
Architecture
Zen 3
Zen 5
Codename
Barcelo-R
Fire Range
Generation
Ryzen 7
(Zen 3 (Cezanne))
Ryzen 9
(Zen 5 (Fire Range))
Process Size
7 nm
4 nm
Transistors
10,700 million
16,630 million
Die Size
180 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
89.6 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FP6
AMD Socket FL1
PCIe
Gen 3, 16 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
6 nm
Graphics
Integrated Graphics
Radeon Graphics (Vega 8)
Radeon 610M
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000000942
100-000001030
Package
FC-BGA1140
µFC-BGAFL1
Tj Max
95°C
100°C
Bundled Cooler
—
None