CPU Comparison

AMD
AMD

AMD Ryzen 3 PRO 8300G

CORE STATE Phoenix2
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3.4 Base / 4.9 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 65W
ARCHITECTURE Zen 4
nm
PROCESS 4 nm
LAUNCH DATE 2024
VS
AMD
AMD

Ryzen 9 9955HX3D

CORE STATE Fire Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.5 Base / 5.4 GHz Turbo
CACHE 128 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,245
5,289
cinebench_cinebench_r15_singlecore
175
746
cinebench_cinebench_r20_multicore
5,190
22,039
cinebench_cinebench_r20_singlecore
732
3,111
cinebench_cinebench_r23_multicore
12,359
52,475
cinebench_cinebench_r23_singlecore
1,744
7,408
passmark_data_compression
163,197
762,606
passmark_data_encryption
9,350
38,516
passmark_extended_instructions
12,360
60,405
passmark_find_prime_numbers
54
521
passmark_floating_point_math
25,293
140,559
passmark_integer_math
40,469
219,084
passmark_multithread
14,540
61,403
passmark_physics
897
4,653
passmark_random_string_sorting
20,343
81,627
passmark_single_thread
3,844
4,492
passmark_singlethread
3,844
4,492

DETAILED SPECIFICATIONS

SPECIFICATION
3 PRO 8300G
9 9955HX3D
Core Specs
Cores
4
16 +300.0%
Threads
8
32 +300.0%
Base Clock (GHz)
3.4
2.5 -26.5%
Boost Clock (GHz)
4.9
5.4 +10.2%
Frequency (GHz)
3.4
2.5 -26.5%
Turbo Clock (GHz)
4.9
5.4 +10.2%
Multiplier
40
25 -37.5%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
8 MB (shared)
128 MB (shared)
Power
TDP (W)
65
55 -15.4%
PPT
61-88 W
74-101 W
Configurable TDP
45 W
75 W
Architecture
Architecture
Zen 4
Zen 5
Codename
Phoenix2
Fire Range
Generation
Ryzen 3 (Zen 4 (Phoenix))
Ryzen 9 (Zen 5 (Fire Range))
Process Size
4 nm
4 nm
Transistors
20,900 million
16,630 million
Die Size
137 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
83.2 GB/s
89.6 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket AM5
AMD Socket FL1
Chipsets
X870E, X870, B850, B840, X670E, X670, B650E, B650, A620
PCIe
Gen 4, 14 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
1 + 3
E-Core Frequency
3.2 GHz up to 3.6 GHz
AMD Multi-Die
IO Process Size
6 nm
Graphics
Integrated Graphics
Radeon 740M
Radeon 610M
Other
Market
Desktop
Mobile
Production Status
Active
Active
Part Number
100-000001187
100-000001030
Package
FC-LGA1718
µFC-BGAFL1
Tj Max
95°C
100°C
Bundled Cooler
Wraith Stealth
None
View Ryzen 3 PRO 8300G Details View Ryzen 9 9955HX3D Details