CPU Comparison
AMD
AMD Ryzen 9 9955HX
CORE STATE
Fire Range
CORE SPECS
16 Cores / 32 Threads
CLOCK SPEED
2.5 Base / 5.4 GHz Turbo
CACHE
64 MB (shared)
MAX TDP
55W
ARCHITECTURE
Zen 5
PROCESS
4 nm
LAUNCH DATE
2025
VS
INTEL
Core i9-11900K
CORE STATE
Rocket Lake
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3.5 Base / 5.3 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
125W
ARCHITECTURE
Rocket Lake
PROCESS
14 nm
LAUNCH DATE
2021
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
geekbench_multicore
geekbench_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
9 9955HX
i9-11900K
Core Specs
Cores
16
8
-50.0%
Threads
32
16
-50.0%
Base Clock (GHz)
2.5
3.5
+40.0%
Boost Clock (GHz)
5.4
5.3
-1.9%
Frequency (GHz)
2.5
3.5
+40.0%
Turbo Clock (GHz)
5.4
5.3
-1.9%
Multiplier
25
35
+40.0%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
64 MB (shared)
16 MB (shared)
Power
TDP (W)
55
125
+127.3%
PPT
74-101 W
—
Configurable TDP
75 W
—
Architecture
Architecture
Zen 5
Rocket Lake
Codename
Fire Range
Rocket Lake
Generation
Ryzen 9
(Zen 5 (Fire Range))
Core i9
(Rocket Lake-S)
Process Size
4 nm
14 nm
Transistors
16,630 million
—
Die Size
2x 70.6 mm²
276 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
51.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket FL1
Intel Socket 1200
Chipsets
—
H510, B560, H570, Q570, W580, Z590, Q470, H470, W480, Z490
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
—
Graphics
Integrated Graphics
Radeon 610M
UHD Graphics 750
Other
Market
Mobile
Desktop
Production Status
Active
End-of-life
Launch Price
—
$539
Part Number
100-000001028
SRKND
Package
µFC-BGAFL1
FC-LGA14A
Tj Max
100°C
100°C
Bundled Cooler
None
—