CPU Comparison

A

AMD

AMD

AMD Ryzen 9 9955HX

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Core i7-8700

CORE STATE Coffee Lake

CORE SPECS 6 Cores / 12 Threads

CLOCK SPEED 3.2 Base / 4.6 GHz Turbo

CACHE 12 MB (shared)

MAX TDP 65W

ARCHITECTURE Coffee Lake

nm

PROCESS 14 nm

LAUNCH DATE 2017

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,922

1,092

cinebench_cinebench_r15_singlecore

694

154

cinebench_cinebench_r20_multicore

20,510

4,553

cinebench_cinebench_r20_singlecore

2,895

642

cinebench_cinebench_r23_multicore

48,834

10,841

cinebench_cinebench_r23_singlecore

6,894

1,530

passmark_data_compression

753,225

187,009

passmark_data_encryption

38,386

4,488

passmark_extended_instructions

59,765

12,432

passmark_find_prime_numbers

296

35

passmark_floating_point_math

140,152

27,839

passmark_integer_math

218,727

44,881

passmark_multithread

57,640

12,756

passmark_physics

2,792

732

passmark_random_string_sorting

79,529

23,963

passmark_single_thread

4,459

2,629

passmark_singlethread

4,459

2,629

DETAILED SPECIFICATIONS

SPECIFICATION

9 9955HX

i7-8700

Core Specs

Cores

16

6 -62.5%

Threads

32

12 -62.5%

Base Clock (GHz)

2.5

3.2 +28.0%

Boost Clock (GHz)

5.4

4.6 -14.8%

Frequency (GHz)

2.5

3.2 +28.0%

Turbo Clock (GHz)

5.4

4.6 -14.8%

Multiplier

25

32 +28.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

64 KB (per core)

L2 Cache

1 MB (per core)

256 KB (per core)

L3 Cache

64 MB (shared)

12 MB (shared)

Power

TDP (W)

55

65 +18.2%

PPT

74-101 W

—

Configurable TDP

75 W

—

Architecture

Architecture

Zen 5

Coffee Lake

Codename

Fire Range

Coffee Lake

Generation

Ryzen 9 (Zen 5 (Fire Range))

Core i7 (Coffee Lake)

Process Size

4 nm

14 nm

Transistors

16,630 million

—

Die Size

2x 70.6 mm²

154 mm²

Foundry

TSMC

Intel

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

89.6 GB/s

42.7 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket FL1

Intel Socket 1151

Chipsets

—

Intel 300 Series, Intel 100/200 Series*

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 3, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

UHD Graphics 630

Other

Market

Mobile

Desktop

Production Status

Active

End-of-life

Launch Price

—

$303

Part Number

100-000001028

SR3QS

Package

µFC-BGAFL1

FC-LGA1151

Tj Max

100°C

—

Bundled Cooler

None

E97379-001

View Ryzen 9 9955HX Details View Core i7-8700 Details