CPU Comparison

AMD
AMD

AMD Ryzen 9 9955HX

CORE STATE Fire Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.5 Base / 5.4 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025
VS
AMD
AMD

Ryzen AI Max PRO 385

CORE STATE Strix Halo
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.6 Base / 5 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
4,922
2,865
cinebench_cinebench_r15_singlecore
694
404
cinebench_cinebench_r20_multicore
20,510
11,938
cinebench_cinebench_r20_singlecore
2,895
1,685
cinebench_cinebench_r23_multicore
48,834
28,424
cinebench_cinebench_r23_singlecore
6,894
4,012
passmark_data_compression
753,225
399,839
passmark_data_encryption
38,386
19,947
passmark_extended_instructions
59,765
33,915
passmark_find_prime_numbers
296
169
passmark_floating_point_math
140,152
72,648
passmark_integer_math
218,727
108,717
passmark_multithread
57,640
33,441
passmark_physics
2,792
1,772
passmark_random_string_sorting
79,529
41,537
passmark_single_thread
4,459
4,052
passmark_singlethread
4,459
4,052

DETAILED SPECIFICATIONS

SPECIFICATION
9 9955HX
AI Max PRO 385
Core Specs
Cores
16
8 -50.0%
Threads
32
16 -50.0%
Base Clock (GHz)
2.5
3.6 +44.0%
Boost Clock (GHz)
5.4
5 -7.4%
Frequency (GHz)
2.5
3.6 +44.0%
Turbo Clock (GHz)
5.4
5 -7.4%
Multiplier
25
36 +44.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
64 MB (shared)
32 MB (shared)
Power
TDP (W)
55
55 0.0%
PPT
74-101 W
โ€”
Configurable TDP
75 W
45-120 W
Architecture
Architecture
Zen 5
Zen 5
Codename
Fire Range
Strix Halo
Generation
Ryzen 9 (Zen 5 (Fire Range))
Ryzen AI Max (Zen 5 (Strix Halo))
Process Size
4 nm
4 nm
Transistors
16,630 million
โ€”
Die Size
2x 70.6 mmยฒ
โ€”
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
LPDDR5X
Memory Bus
Dual-channel
Quad-channel
Memory Bandwidth
89.6 GB/s
256.0 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FL1
AMD Socket FP11
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
โ€”
AI/NPU
NPU
โ€”
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon 610M
Radeon 8050S
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000001028
100-000001422
Package
ยตFC-BGAFL1
FC-BGA
Tj Max
100ยฐC
100ยฐC
Bundled Cooler
None
โ€”
View Ryzen 9 9955HX Details View Ryzen AI Max PRO 385 Details