CPU Comparison

A

AMD

AMD

AMD Ryzen 9 9955HX

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

VS

A

AMD

AMD

Ryzen 9 PRO 6950HS

CORE STATE Rembrandt

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.3 Base / 4.9 GHz Turbo

CACHE 16 MB (shared)

MAX TDP 35W

ARCHITECTURE Zen 3+

nm

PROCESS 6 nm

LAUNCH DATE 2022

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,922

1,951

cinebench_cinebench_r15_singlecore

694

275

cinebench_cinebench_r20_multicore

20,510

8,130

cinebench_cinebench_r20_singlecore

2,895

1,147

cinebench_cinebench_r23_multicore

48,834

19,358

cinebench_cinebench_r23_singlecore

6,894

2,733

passmark_data_compression

753,225

282,624

passmark_data_encryption

38,386

17,837

passmark_extended_instructions

59,765

18,897

passmark_find_prime_numbers

296

56

passmark_floating_point_math

140,152

48,096

passmark_integer_math

218,727

88,124

passmark_multithread

57,640

22,775

passmark_physics

2,792

1,043

passmark_random_string_sorting

79,529

29,350

passmark_single_thread

4,459

3,400

passmark_singlethread

4,459

3,400

geekbench_multicore

N/A

8,756

geekbench_singlecore

N/A

1,903

DETAILED SPECIFICATIONS

SPECIFICATION

9 9955HX

9 PRO 6950HS

Core Specs

Cores

16

8 -50.0%

Threads

32

16 -50.0%

Base Clock (GHz)

2.5

3.3 +32.0%

Boost Clock (GHz)

5.4

4.9 -9.3%

Frequency (GHz)

2.5

3.3 +32.0%

Turbo Clock (GHz)

5.4

4.9 -9.3%

Multiplier

25

33 +32.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

80 KB (per core)

64 KB (per core)

L2 Cache

1 MB (per core)

512 KB (per core)

L3 Cache

64 MB (shared)

16 MB (shared)

Power

TDP (W)

55

35 -36.4%

PPT

74-101 W

—

Configurable TDP

75 W

—

Architecture

Architecture

Zen 5

Zen 3+

Codename

Fire Range

Rembrandt

Generation

Ryzen 9 (Zen 5 (Fire Range))

Ryzen 9 (Zen 3+ (Rembrandt))

Process Size

4 nm

6 nm

Transistors

16,630 million

—

Die Size

2x 70.6 mm²

208 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

DDR5

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

89.6 GB/s

76.8 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket FL1

AMD Socket FP7

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 4, 20 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

Radeon 680M

Other

Market

Mobile

Mobile

Production Status

Active

Active

Part Number

100-000001028

100-000000541100-000000563

Package

µFC-BGAFL1

FP7, FP7r2

Tj Max

100°C

95°C

Bundled Cooler

None

—

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