CPU Comparison

AMD
AMD

AMD Ryzen 3 7335U

CORE STATE Rembrandt-R
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3 Base / 4.3 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 28W
ARCHITECTURE Zen 3+
nm
PROCESS 6 nm
LAUNCH DATE 2023
VS
AMD
AMD

Ryzen 9 9955HX

CORE STATE Fire Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.5 Base / 5.4 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,078
4,922
cinebench_cinebench_r15_singlecore
152
694
cinebench_cinebench_r20_multicore
4,495
20,510
cinebench_cinebench_r20_singlecore
634
2,895
cinebench_cinebench_r23_multicore
10,703
48,834
cinebench_cinebench_r23_singlecore
1,511
6,894
passmark_data_compression
146,309
753,225
passmark_data_encryption
9,335
38,386
passmark_extended_instructions
10,314
59,765
passmark_find_prime_numbers
36
296
passmark_floating_point_math
24,298
140,152
passmark_integer_math
42,493
218,727
passmark_multithread
12,592
57,640
passmark_physics
647
2,792
passmark_random_string_sorting
15,361
79,529
passmark_single_thread
3,053
4,459
passmark_singlethread
3,053
4,459

DETAILED SPECIFICATIONS

SPECIFICATION
3 7335U
9 9955HX
Core Specs
Cores
4
16 +300.0%
Threads
8
32 +300.0%
Base Clock (GHz)
3
2.5 -16.7%
Boost Clock (GHz)
4.3
5.4 +25.6%
Frequency (GHz)
3
2.5 -16.7%
Turbo Clock (GHz)
4.3
5.4 +25.6%
Multiplier
30
25 -16.7%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
8 MB (shared)
64 MB (shared)
Power
TDP (W)
28
55 +96.4%
PPT
74-101 W
Configurable TDP
75 W
Architecture
Architecture
Zen 3+
Zen 5
Codename
Rembrandt-R
Fire Range
Generation
Ryzen 3 (Zen 3+ (Rembrandt))
Ryzen 9 (Zen 5 (Fire Range))
Process Size
6 nm
4 nm
Transistors
16,630 million
Die Size
208 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
76.8 GB/s
89.6 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FP7
AMD Socket FL1
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Graphics
Integrated Graphics
Radeon 660M
Radeon 610M
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000000537(FP7)100-000000549(FP7r2)
100-000001028
Package
FP7, FP7r2
µFC-BGAFL1
Tj Max
95°C
100°C
Bundled Cooler
None
View Ryzen 3 7335U Details View Ryzen 9 9955HX Details