CPU Comparison

A

AMD

AMD

AMD Ryzen 9 8945HX

CORE STATE Dragon Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Xeon Platinum 8260M

CORE STATE Cascade Lake-SP

CORE SPECS 24 Cores / 48 Threads

CLOCK SPEED 2.4 Base / 3.9 GHz Turbo

CACHE 35.75 MB (shared)

MAX TDP 165W

ARCHITECTURE Cascade Lake

nm

PROCESS 14 nm

LAUNCH DATE 2018

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,305

2,963

cinebench_cinebench_r15_singlecore

607

418

cinebench_cinebench_r20_multicore

17,939

12,349

cinebench_cinebench_r20_singlecore

2,532

1,743

cinebench_cinebench_r23_multicore

42,713

29,403

cinebench_cinebench_r23_singlecore

6,030

4,151

passmark_data_compression

646,896

573,896

passmark_data_encryption

39,600

17,625

passmark_extended_instructions

47,600

35,529

passmark_find_prime_numbers

267

141

passmark_floating_point_math

118,280

73,514

passmark_integer_math

198,352

129,213

passmark_multithread

50,251

34,592

passmark_physics

2,027

2,080

passmark_random_string_sorting

74,420

69,236

passmark_single_thread

3,963

2,320

passmark_singlethread

3,963

2,320

DETAILED SPECIFICATIONS

SPECIFICATION

9 8945HX

Platinum 8260M

Core Specs

Cores

16

24 +50.0%

Threads

32

48 +50.0%

Base Clock (GHz)

2.5

2.4 -4.0%

Boost Clock (GHz)

5.4

3.9 -27.8%

Frequency (GHz)

2.5

2.4 -4.0%

Turbo Clock (GHz)

5.4

3.9 -27.8%

Multiplier

24

24 0.0%

SMP CPUs

1

8 +700.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

64 MB (shared)

35.75 MB (shared)

Power

TDP (W)

55

165 +200.0%

Configurable TDP

45-75 W

—

Architecture

Architecture

Zen 4

Cascade Lake

Codename

Dragon Range

Cascade Lake-SP

Generation

Ryzen 9 (Zen 4 (Dragon Range))

Xeon Platinum (Cascade Lake-SP)

Process Size

5 nm

14 nm

Transistors

13,140 million

8,000 million

Die Size

2x 71 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

—

Memory Bandwidth

83.2 GB/s

—

ECC Memory

No

Yes

Platform

Socket

AMD Socket FL1

Intel Socket 3647

PCIe

Gen 5, 28 Lanes(CPU only)

—

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

—

Other

Market

Mobile

Server/Workstation

Production Status

Active

—

Part Number

100-000001848

SRF9JCD8069504201201

Package

µFC-BGAFL1

FC-LGA3647

Tj Max

100°C

—

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