CPU Comparison

AMD
AMD

AMD Ryzen 9 8945HX

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.5 Base / 5.4 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025
VS
Intel
INTEL

Core i7-11700KF

CORE STATE Rocket Lake
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.6 Base / 5 GHz Turbo
CACHE 16 MB (shared)
MAX TDP 125W
ARCHITECTURE Rocket Lake
nm
PROCESS 14 nm
LAUNCH DATE 2021

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
4,305
2,040
cinebench_cinebench_r15_singlecore
607
288
cinebench_cinebench_r20_multicore
17,939
8,503
cinebench_cinebench_r20_singlecore
2,532
1,200
cinebench_cinebench_r23_multicore
42,713
20,247
cinebench_cinebench_r23_singlecore
6,030
2,858
passmark_data_compression
646,896
317,712
passmark_data_encryption
39,600
15,229
passmark_extended_instructions
47,600
22,247
passmark_find_prime_numbers
267
62
passmark_floating_point_math
118,280
50,571
passmark_integer_math
198,352
85,377
passmark_multithread
50,251
23,819
passmark_physics
2,027
985
passmark_random_string_sorting
74,420
36,309
passmark_single_thread
3,963
3,368
passmark_singlethread
3,963
3,368
3dmark_16_threads
N/A
8,067
3dmark_2_threads
N/A
1,909
3dmark_4_threads
N/A
3,645
3dmark_8_threads
N/A
6,294
3dmark_max_threads
N/A
8,049
3dmark_single_thread
N/A
978
geekbench_multicore
N/A
10,256
geekbench_singlecore
N/A
2,278

DETAILED SPECIFICATIONS

SPECIFICATION
9 8945HX
i7-11700KF
Core Specs
Cores
16
8 -50.0%
Threads
32
16 -50.0%
Base Clock (GHz)
2.5
3.6 +44.0%
Boost Clock (GHz)
5.4
5 -7.4%
Frequency (GHz)
2.5
3.6 +44.0%
Turbo Clock (GHz)
5.4
5 -7.4%
Multiplier
24
36 +50.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
64 MB (shared)
16 MB (shared)
Power
TDP (W)
55
125 +127.3%
Configurable TDP
45-75 W
—
Architecture
Architecture
Zen 4
Rocket Lake
Codename
Dragon Range
Rocket Lake
Generation
Ryzen 9 (Zen 4 (Dragon Range))
Core i7 (Rocket Lake-S)
Process Size
5 nm
14 nm
Transistors
13,140 million
—
Die Size
2x 71 mm²
276 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
83.2 GB/s
51.2 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket FL1
Intel Socket 1200
Chipsets
—
H510, B560, H570, Q570, W580, Z590, Q470, H470, W480, Z490
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
—
Graphics
Integrated Graphics
Radeon 610M
—
Other
Market
Mobile
Desktop
Production Status
Active
End-of-life
Launch Price
—
$374
Part Number
100-000001848
SRKNN
Package
µFC-BGAFL1
FC-LGA14A
Tj Max
100°C
100°C
View Ryzen 9 8945HX Details View Core i7-11700KF Details