CPU Comparison

A

AMD

AMD

AMD Ryzen 9 8945HX

CORE STATE Dragon Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Core i3-13100F

CORE STATE Raptor Lake-S

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 3.4 Base / 4.5 GHz Turbo

CACHE 12 MB (shared)

MAX TDP 58W

ARCHITECTURE Raptor Lake

nm

PROCESS 10 nm

LAUNCH DATE 2023

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,305

1,258

cinebench_cinebench_r15_singlecore

607

177

cinebench_cinebench_r20_multicore

17,939

5,242

cinebench_cinebench_r20_singlecore

2,532

740

cinebench_cinebench_r23_multicore

42,713

12,483

cinebench_cinebench_r23_singlecore

6,030

1,762

passmark_data_compression

646,896

168,043

passmark_data_encryption

39,600

8,496

passmark_extended_instructions

47,600

11,407

passmark_find_prime_numbers

267

61

passmark_floating_point_math

118,280

33,510

passmark_integer_math

198,352

43,038

passmark_multithread

50,251

14,687

passmark_physics

2,027

1,055

passmark_random_string_sorting

74,420

16,569

passmark_single_thread

3,963

3,609

passmark_singlethread

3,963

3,609

geekbench_multicore

N/A

7,626

geekbench_singlecore

N/A

2,263

DETAILED SPECIFICATIONS

SPECIFICATION

9 8945HX

i3-13100F

Core Specs

Cores

16

4 -75.0%

Threads

32

8 -75.0%

Base Clock (GHz)

2.5

3.4 +36.0%

Boost Clock (GHz)

5.4

4.5 -16.7%

Frequency (GHz)

2.5

3.4 +36.0%

Turbo Clock (GHz)

5.4

4.5 -16.7%

Multiplier

24

34 +41.7%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1.25 MB (per core)

L3 Cache

64 MB (shared)

12 MB (shared)

Power

TDP (W)

55

58 +5.5%

PL1

—

58 W

PL2

—

89 W

Configurable TDP

45-75 W

—

Architecture

Architecture

Zen 4

Raptor Lake

Codename

Dragon Range

Raptor Lake-S

Generation

Ryzen 9 (Zen 4 (Dragon Range))

Core i3 (Raptor Lake)

Process Size

5 nm

10 nm

Transistors

13,140 million

—

Die Size

2x 71 mm²

163 mm²

Foundry

TSMC

Intel

Memory

Memory Support

DDR5

DDR4, DDR5

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

83.2 GB/s

—

ECC Memory

No

No

DDR4 Speed

—

3200 MT/s

DDR5 Speed

—

4800 MT/s

Platform

Socket

AMD Socket FL1

Intel Socket 1700

Chipsets

—

B660, Z690, B760, Z790

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 5, 20 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

—

Other

Market

Mobile

Desktop

Production Status

Active

Active

Launch Price

—

$109

Part Number

100-000001848

SRMBV

Package

µFC-BGAFL1

FC-LGA16A

Tj Max

100°C

100°C

Bundled Cooler

—

Laminar RM1

View Ryzen 9 8945HX Details View Core i3-13100F Details