CPU Comparison

AMD
AMD

AMD Ryzen 9 5900

CORE STATE Vermeer
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3 Base / 4.7 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2021
VS
AMD
AMD

Ryzen 9 8945HX

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.5 Base / 5.4 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,906
4,305
cinebench_cinebench_r15_singlecore
410
607
cinebench_cinebench_r20_multicore
12,110
17,939
cinebench_cinebench_r20_singlecore
1,709
2,532
cinebench_cinebench_r23_multicore
28,834
42,713
cinebench_cinebench_r23_singlecore
4,070
6,030
passmark_data_compression
411,453
646,896
passmark_data_encryption
26,247
39,600
passmark_extended_instructions
26,859
47,600
passmark_find_prime_numbers
213
267
passmark_floating_point_math
69,124
118,280
passmark_integer_math
128,641
198,352
passmark_multithread
33,969
50,251
passmark_physics
1,697
2,027
passmark_random_string_sorting
43,386
74,420
passmark_single_thread
3,439
3,963
passmark_singlethread
3,439
3,963

DETAILED SPECIFICATIONS

SPECIFICATION
9 5900
9 8945HX
Core Specs
Cores
12
16 +33.3%
Threads
24
32 +33.3%
Base Clock (GHz)
3
2.5 -16.7%
Boost Clock (GHz)
4.7
5.4 +14.9%
Frequency (GHz)
3
2.5 -16.7%
Turbo Clock (GHz)
4.7
5.4 +14.9%
Multiplier
30
24 -20.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
64 MB
64 MB (shared)
Power
TDP (W)
65
55 -15.4%
PPT
88 W
Configurable TDP
45-75 W
Architecture
Architecture
Zen 3
Zen 4
Codename
Vermeer
Dragon Range
Generation
Ryzen 9 (Zen 3 (Vermeer))
Ryzen 9 (Zen 4 (Dragon Range))
Process Size
7 nm
5 nm
Transistors
8,300 million
13,140 million
Die Size
2x 74 mm²
2x 71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
83.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket AM4
AMD Socket FL1
Chipsets
AMD 300 Series*, AMD 400 Series, AMD 500 Series
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
6 nm
Graphics
Integrated Graphics
Radeon 610M
Other
Market
Desktop
Mobile
Production Status
Active
Active
Part Number
100-000000062
100-000001848
Package
µOPGA-1331
µFC-BGAFL1
Tj Max
100°C
Bundled Cooler
None
View Ryzen 9 5900 Details View Ryzen 9 8945HX Details