CPU Comparison

A

AMD

AMD

AMD Ryzen 7 3700X

CORE STATE Matisse

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.6 Base / 4.4 GHz Turbo

CACHE 32 MB

MAX TDP 65W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

A

AMD

AMD

Ryzen 9 8945HX

CORE STATE Dragon Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,923

4,305

cinebench_cinebench_r15_singlecore

271

607

cinebench_cinebench_r20_multicore

8,016

17,939

cinebench_cinebench_r20_singlecore

1,131

2,532

cinebench_cinebench_r23_multicore

19,087

42,713

cinebench_cinebench_r23_singlecore

2,694

6,030

geekbench_multicore

8,083

N/A

geekbench_singlecore

1,672

N/A

passmark_data_compression

296,379

646,896

passmark_data_encryption

18,900

39,600

passmark_extended_instructions

19,241

47,600

passmark_find_prime_numbers

99

267

passmark_floating_point_math

39,005

118,280

passmark_integer_math

66,399

198,352

passmark_multithread

22,458

50,251

passmark_physics

1,181

2,027

passmark_random_string_sorting

32,131

74,420

passmark_single_thread

2,656

3,963

passmark_singlethread

2,656

3,963

DETAILED SPECIFICATIONS

SPECIFICATION

7 3700X

9 8945HX

Core Specs

Cores

8

16 +100.0%

Threads

16

32 +100.0%

Base Clock (GHz)

3.6

2.5 -30.6%

Boost Clock (GHz)

4.4

5.4 +22.7%

Frequency (GHz)

3.6

2.5 -30.6%

Turbo Clock (GHz)

4.4

5.4 +22.7%

Multiplier

36

24 -33.3%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

32 MB

64 MB (shared)

Power

TDP (W)

65

55 -15.4%

PPT

88 W

—

Configurable TDP

—

45-75 W

Architecture

Architecture

Zen 2

Zen 4

Codename

Matisse

Dragon Range

Generation

Ryzen 7 (Zen 2 (Matisse))

Ryzen 9 (Zen 4 (Dragon Range))

Process Size

7 nm

5 nm

Transistors

3,800 million

13,140 million

Die Size

74 mm²

2x 71 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

DDR5

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

83.2 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket AM4

AMD Socket FL1

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

Gen 5, 28 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

6 nm

Graphics

Integrated Graphics

—

Radeon 610M

Other

Market

Desktop

Mobile

Production Status

Active

Active

Launch Price

$329

—

Part Number

100-000000071

100-000001848

Package

µOPGA-1331

µFC-BGAFL1

Tj Max

—

100°C

View Ryzen 7 3700X Details View Ryzen 9 8945HX Details