CPU Comparison

A

AMD

AMD

AMD Ryzen 3 7335U

CORE STATE Rembrandt-R

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 3 Base / 4.3 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 28W

ARCHITECTURE Zen 3+

nm

PROCESS 6 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen 9 8945HX

CORE STATE Dragon Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,078

4,305

cinebench_cinebench_r15_singlecore

152

607

cinebench_cinebench_r20_multicore

4,495

17,939

cinebench_cinebench_r20_singlecore

634

2,532

cinebench_cinebench_r23_multicore

10,703

42,713

cinebench_cinebench_r23_singlecore

1,511

6,030

passmark_data_compression

146,309

646,896

passmark_data_encryption

9,335

39,600

passmark_extended_instructions

10,314

47,600

passmark_find_prime_numbers

36

267

passmark_floating_point_math

24,298

118,280

passmark_integer_math

42,493

198,352

passmark_multithread

12,592

50,251

passmark_physics

647

2,027

passmark_random_string_sorting

15,361

74,420

passmark_single_thread

3,053

3,963

passmark_singlethread

3,053

3,963

DETAILED SPECIFICATIONS

SPECIFICATION

3 7335U

9 8945HX

Core Specs

Cores

4

16 +300.0%

Threads

8

32 +300.0%

Base Clock (GHz)

3

2.5 -16.7%

Boost Clock (GHz)

4.3

5.4 +25.6%

Frequency (GHz)

3

2.5 -16.7%

Turbo Clock (GHz)

4.3

5.4 +25.6%

Multiplier

30

24 -20.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

8 MB (shared)

64 MB (shared)

Power

TDP (W)

28

55 +96.4%

Configurable TDP

—

45-75 W

Architecture

Architecture

Zen 3+

Zen 4

Codename

Rembrandt-R

Dragon Range

Generation

Ryzen 3 (Zen 3+ (Rembrandt))

Ryzen 9 (Zen 4 (Dragon Range))

Process Size

6 nm

5 nm

Transistors

—

13,140 million

Die Size

208 mm²

2x 71 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

DDR5

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

76.8 GB/s

83.2 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket FP7

AMD Socket FL1

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 5, 28 Lanes(CPU only)

AMD Multi-Die

IO Process Size

—

6 nm

Graphics

Integrated Graphics

Radeon 660M

Radeon 610M

Other

Market

Mobile

Mobile

Production Status

Active

Active

Part Number

100-000000537(FP7)100-000000549(FP7r2)

100-000001848

Package

FP7, FP7r2

µFC-BGAFL1

Tj Max

95°C

100°C

View Ryzen 3 7335U Details View Ryzen 9 8945HX Details