CPU Comparison

AMD
AMD

AMD EPYC 8024P

CORE STATE Siena
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 2.4 Base / 3 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 90W
ARCHITECTURE Zen 4c
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
AMD
AMD

Ryzen 9 8945HX

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.5 Base / 5.4 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,761
4,305
cinebench_cinebench_r15_singlecore
248
607
cinebench_cinebench_r20_multicore
7,338
17,939
cinebench_cinebench_r20_singlecore
1,035
2,532
cinebench_cinebench_r23_multicore
17,472
42,713
cinebench_cinebench_r23_singlecore
2,466
6,030
passmark_data_compression
232,242
646,896
passmark_data_encryption
15,809
39,600
passmark_extended_instructions
14,251
47,600
passmark_find_prime_numbers
109
267
passmark_floating_point_math
34,757
118,280
passmark_integer_math
62,128
198,352
passmark_multithread
20,556
50,251
passmark_physics
1,905
2,027
passmark_random_string_sorting
34,613
74,420
passmark_single_thread
2,371
3,963
passmark_singlethread
2,371
3,963

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 8024P
9 8945HX
Core Specs
Cores
8
16 +100.0%
Threads
16
32 +100.0%
Base Clock (GHz)
2.4
2.5 +4.2%
Boost Clock (GHz)
3
5.4 +80.0%
Frequency (GHz)
2.4
2.5 +4.2%
Turbo Clock (GHz)
3
5.4 +80.0%
Multiplier
24
24 0.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
32 MB (shared)
64 MB (shared)
Power
TDP (W)
90
55 -38.9%
Configurable TDP
70-100 W
45-75 W
Architecture
Architecture
Zen 4c
Zen 4
Codename
Siena
Dragon Range
Generation
EPYC (Zen 4c (Siena))
Ryzen 9 (Zen 4 (Dragon Range))
Process Size
5 nm
5 nm
Transistors
8,875 million
13,140 million
Die Size
73 mm²
2x 71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Six-channel
Dual-channel
Memory Bandwidth
230.4 GB/s
83.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket SP6
AMD Socket FL1
PCIe
Gen 5, 96 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
6 nm
Graphics
Integrated Graphics
—
Radeon 610M
Other
Market
Server/Workstation
Mobile
Production Status
Active
Active
Launch Price
$409
—
Part Number
100-000001136
100-000001848
Package
FC-LGA4844
µFC-BGAFL1
Tj Max
—
100°C
Bundled Cooler
None
—
View EPYC 8024P Details View Ryzen 9 8945HX Details