CPU Comparison

A

AMD

AMD

AMD Ryzen 9 8940HX

CORE STATE Dragon Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.4 Base / 5.3 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2025

VS

i

Intel

INTEL

Xeon Phi 7210

CORE STATE Knights Landing

CORE SPECS 64 Cores / 256 Threads

CLOCK SPEED 1300 Base / 1500 GHz Turbo

CACHE —

MAX TDP 215W

ARCHITECTURE Knights Landing

nm

PROCESS 14 nm

LAUNCH DATE 2016

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,584

625

cinebench_cinebench_r15_singlecore

647

88

cinebench_cinebench_r20_multicore

19,104

2,608

cinebench_cinebench_r20_singlecore

2,696

367

cinebench_cinebench_r23_multicore

45,488

6,210

cinebench_cinebench_r23_singlecore

6,421

876

passmark_data_compression

738,673

332,960

passmark_data_encryption

44,430

3,455

passmark_extended_instructions

54,674

18,359

passmark_find_prime_numbers

272

10

passmark_floating_point_math

125,981

29,356

passmark_integer_math

205,945

84,874

passmark_multithread

54,675

7,306

passmark_physics

2,115

198

passmark_random_string_sorting

85,869

8,956

passmark_single_thread

4,033

460

passmark_singlethread

4,033

460

DETAILED SPECIFICATIONS

SPECIFICATION

9 8940HX

Phi 7210

Core Specs

Cores

16

64 +300.0%

Threads

32

256 +700.0%

Base Clock (GHz)

2.4

1,300 +54066.7%

Boost Clock (GHz)

5.3

1,500 +28201.9%

Frequency (GHz)

2.4

1,300 +54066.7%

Turbo Clock (GHz)

5.3

1,500 +28201.9%

Multiplier

24

13 -45.8%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

32 KB (per core)

L2 Cache

1 MB (per core)

512 KB (per core)

L3 Cache

64 MB (shared)

—

Power

TDP (W)

55

215 +290.9%

Configurable TDP

45-75 W

—

Architecture

Architecture

Zen 4

Knights Landing

Codename

Dragon Range

Knights Landing

Generation

Ryzen 9 (Zen 4 (Dragon Range))

Xeon Phi (Knights Landing)

Process Size

5 nm

14 nm

Transistors

13,140 million

8,000 million

Die Size

2x 71 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

—

Memory Bandwidth

83.2 GB/s

—

ECC Memory

No

Yes

Platform

Socket

AMD Socket FL1

Intel Socket 3647

PCIe

Gen 5, 28 Lanes(CPU only)

—

AMD Multi-Die

IO Process Size

6 nm

—

Graphics

Integrated Graphics

Radeon 610M

—

Other

Market

Mobile

Server/Workstation

Production Status

Active

—

Part Number

100-000001849

SR2MESR2X4

Package

µFC-BGAFL1

FC-LGA3647

Tj Max

100°C

—

View Ryzen 9 8940HX Details View Xeon Phi 7210 Details