CPU Comparison

A

AMD

AMD

AMD Ryzen 9 8940HX

CORE STATE Dragon Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.4 Base / 5.3 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2025

VS

A

AMD

AMD

Ryzen AI Max PRO 390

CORE STATE Strix Halo

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.2 Base / 5 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,584

3,700

cinebench_cinebench_r15_singlecore

647

522

cinebench_cinebench_r20_multicore

19,104

15,418

cinebench_cinebench_r20_singlecore

2,696

2,176

cinebench_cinebench_r23_multicore

45,488

36,710

cinebench_cinebench_r23_singlecore

6,421

5,182

passmark_data_compression

738,673

505,322

passmark_data_encryption

44,430

26,115

passmark_extended_instructions

54,674

40,687

passmark_find_prime_numbers

272

333

passmark_floating_point_math

125,981

96,002

passmark_integer_math

205,945

150,375

passmark_multithread

54,675

43,189

passmark_physics

2,115

2,769

passmark_random_string_sorting

85,869

55,663

passmark_single_thread

4,033

3,997

passmark_singlethread

4,033

3,997

DETAILED SPECIFICATIONS

SPECIFICATION

9 8940HX

AI Max PRO 390

Core Specs

Cores

16

12 -25.0%

Threads

32

24 -25.0%

Base Clock (GHz)

2.4

3.2 +33.3%

Boost Clock (GHz)

5.3

5 -5.7%

Frequency (GHz)

2.4

3.2 +33.3%

Turbo Clock (GHz)

5.3

5 -5.7%

Multiplier

24

32 +33.3%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

64 MB (shared)

64 MB (shared)

Power

TDP (W)

55

55 0.0%

Configurable TDP

45-75 W

45-120 W

Architecture

Architecture

Zen 4

Zen 5

Codename

Dragon Range

Strix Halo

Generation

Ryzen 9 (Zen 4 (Dragon Range))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

5 nm

4 nm

Transistors

13,140 million

—

Die Size

2x 71 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

83.2 GB/s

256.0 GB/s

ECC Memory

No

Yes

Platform

Socket

AMD Socket FL1

AMD Socket FP11

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

Radeon 610M

Radeon 8050S

Other

Market

Mobile

Mobile

Production Status

Active

Active

Part Number

100-000001849

100-000001421

Package

µFC-BGAFL1

FC-BGA

Tj Max

100°C

100°C

View Ryzen 9 8940HX Details View Ryzen AI Max PRO 390 Details