CPU Comparison

A

AMD

AMD

AMD Ryzen 9 8940HX

CORE STATE Dragon Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.4 Base / 5.3 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2025

VS

A

AMD

AMD

Ryzen AI Max+ 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

4,584

4,558

cinebench_cinebench_r15_singlecore

647

643

cinebench_cinebench_r20_multicore

19,104

18,995

cinebench_cinebench_r20_singlecore

2,696

2,681

cinebench_cinebench_r23_multicore

45,488

45,228

cinebench_cinebench_r23_singlecore

6,421

6,385

passmark_data_compression

738,673

656,891

passmark_data_encryption

44,430

34,086

passmark_extended_instructions

54,674

52,958

passmark_find_prime_numbers

272

298

passmark_floating_point_math

125,981

123,833

passmark_integer_math

205,945

195,223

passmark_multithread

54,675

53,137

passmark_physics

2,115

3,448

passmark_random_string_sorting

85,869

72,894

passmark_single_thread

4,033

4,123

passmark_singlethread

4,033

4,123

DETAILED SPECIFICATIONS

SPECIFICATION

9 8940HX

AI Max+ 395

Core Specs

Cores

16

16 0.0%

Threads

32

32 0.0%

Base Clock (GHz)

2.4

3 +25.0%

Boost Clock (GHz)

5.3

5.1 -3.8%

Frequency (GHz)

2.4

3 +25.0%

Turbo Clock (GHz)

5.3

5.1 -3.8%

Multiplier

24

30 +25.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

1 MB (per core)

1 MB (per core)

L3 Cache

64 MB (shared)

64 MB (shared)

Power

TDP (W)

55

55 0.0%

Configurable TDP

45-75 W

45-120 W

Architecture

Architecture

Zen 4

Zen 5

Codename

Dragon Range

Strix Halo

Generation

Ryzen 9 (Zen 4 (Dragon Range))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

5 nm

4 nm

Transistors

13,140 million

—

Die Size

2x 71 mm²

2x 70.6 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

83.2 GB/s

256.0 GB/s

ECC Memory

No

Yes

Platform

Socket

AMD Socket FL1

AMD Socket FP11

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

Radeon 610M

Radeon 8060S

Other

Market

Mobile

Mobile

Production Status

Active

Active

Part Number

100-000001849

100-000001099

Package

µFC-BGAFL1

FC-BGA

Tj Max

100°C

100°C

View Ryzen 9 8940HX Details View Ryzen AI Max+ 395 Details