CPU Comparison

AMD
AMD

AMD Ryzen 9 8940HX

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.4 Base / 5.3 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025
VS
AMD
AMD

Ryzen 9 PRO 5945

CORE STATE Vermeer
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3 Base / 4.7 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2022

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
4,584
2,959
cinebench_cinebench_r15_singlecore
647
417
cinebench_cinebench_r20_multicore
19,104
12,333
cinebench_cinebench_r20_singlecore
2,696
1,740
cinebench_cinebench_r23_multicore
45,488
29,366
cinebench_cinebench_r23_singlecore
6,421
4,145
passmark_data_compression
738,673
416,599
passmark_data_encryption
44,430
26,313
passmark_extended_instructions
54,674
27,031
passmark_find_prime_numbers
272
228
passmark_floating_point_math
125,981
70,291
passmark_integer_math
205,945
129,768
passmark_multithread
54,675
34,549
passmark_physics
2,115
1,772
passmark_random_string_sorting
85,869
43,447
passmark_single_thread
4,033
3,499
passmark_singlethread
4,033
3,499

DETAILED SPECIFICATIONS

SPECIFICATION
9 8940HX
9 PRO 5945
Core Specs
Cores
16
12 -25.0%
Threads
32
24 -25.0%
Base Clock (GHz)
2.4
3 +25.0%
Boost Clock (GHz)
5.3
4.7 -11.3%
Frequency (GHz)
2.4
3 +25.0%
Turbo Clock (GHz)
5.3
4.7 -11.3%
Multiplier
24
30 +25.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
64 MB (shared)
64 MB
Power
TDP (W)
55
65 +18.2%
PPT
88 W
Configurable TDP
45-75 W
Architecture
Architecture
Zen 4
Zen 3
Codename
Dragon Range
Vermeer
Generation
Ryzen 9 (Zen 4 (Dragon Range))
Ryzen 9 (Zen 3 (Vermeer))
Process Size
5 nm
7 nm
Transistors
13,140 million
8,300 million
Die Size
2x 71 mm²
2x 74 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
83.2 GB/s
51.2 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket FL1
AMD Socket AM4
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
12 nm
Graphics
Integrated Graphics
Radeon 610M
Other
Market
Mobile
Desktop
Production Status
Active
Active
Part Number
100-000001849
100-000000831
Package
µFC-BGAFL1
µOPGA-1331
Tj Max
100°C
Bundled Cooler
None
View Ryzen 9 8940HX Details View Ryzen 9 PRO 5945 Details