CPU Comparison

A

AMD

AMD

AMD Ryzen 9 5900

CORE STATE Vermeer

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3 Base / 4.7 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2021

VS

A

AMD

AMD

Ryzen 9 8940HX

CORE STATE Dragon Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.4 Base / 5.3 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,906

4,584

cinebench_cinebench_r15_singlecore

410

647

cinebench_cinebench_r20_multicore

12,110

19,104

cinebench_cinebench_r20_singlecore

1,709

2,696

cinebench_cinebench_r23_multicore

28,834

45,488

cinebench_cinebench_r23_singlecore

4,070

6,421

passmark_data_compression

411,453

738,673

passmark_data_encryption

26,247

44,430

passmark_extended_instructions

26,859

54,674

passmark_find_prime_numbers

213

272

passmark_floating_point_math

69,124

125,981

passmark_integer_math

128,641

205,945

passmark_multithread

33,969

54,675

passmark_physics

1,697

2,115

passmark_random_string_sorting

43,386

85,869

passmark_single_thread

3,439

4,033

passmark_singlethread

3,439

4,033

DETAILED SPECIFICATIONS

SPECIFICATION

9 5900

9 8940HX

Core Specs

Cores

12

16 +33.3%

Threads

24

32 +33.3%

Base Clock (GHz)

3

2.4 -20.0%

Boost Clock (GHz)

4.7

5.3 +12.8%

Frequency (GHz)

3

2.4 -20.0%

Turbo Clock (GHz)

4.7

5.3 +12.8%

Multiplier

30

24 -20.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

64 MB

64 MB (shared)

Power

TDP (W)

65

55 -15.4%

PPT

88 W

—

Configurable TDP

—

45-75 W

Architecture

Architecture

Zen 3

Zen 4

Codename

Vermeer

Dragon Range

Generation

Ryzen 9 (Zen 3 (Vermeer))

Ryzen 9 (Zen 4 (Dragon Range))

Process Size

7 nm

5 nm

Transistors

8,300 million

13,140 million

Die Size

2x 74 mm²

2x 71 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

DDR5

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

83.2 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket AM4

AMD Socket FL1

Chipsets

AMD 300 Series*, AMD 400 Series, AMD 500 Series

—

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 5, 28 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

6 nm

Graphics

Integrated Graphics

—

Radeon 610M

Other

Market

Desktop

Mobile

Production Status

Active

Active

Part Number

100-000000062

100-000001849

Package

µOPGA-1331

µFC-BGAFL1

Tj Max

—

100°C

Bundled Cooler

None

—

View Ryzen 9 5900 Details View Ryzen 9 8940HX Details