CPU Comparison

A

AMD

AMD

AMD Ryzen 7 PRO 5845

CORE STATE Vermeer

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.4 Base / 4.6 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 65W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2022

VS

A

AMD

AMD

Ryzen 9 8940HX

CORE STATE Dragon Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.4 Base / 5.3 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,232

4,584

cinebench_cinebench_r15_singlecore

314

647

cinebench_cinebench_r20_multicore

9,300

19,104

cinebench_cinebench_r20_singlecore

1,312

2,696

cinebench_cinebench_r23_multicore

22,145

45,488

cinebench_cinebench_r23_singlecore

3,126

6,421

passmark_data_compression

314,363

738,673

passmark_data_encryption

19,815

44,430

passmark_extended_instructions

21,117

54,674

passmark_find_prime_numbers

115

272

passmark_floating_point_math

52,105

125,981

passmark_integer_math

94,884

205,945

passmark_multithread

26,054

54,675

passmark_physics

1,109

2,115

passmark_random_string_sorting

33,754

85,869

passmark_single_thread

3,442

4,033

passmark_singlethread

3,442

4,033

DETAILED SPECIFICATIONS

SPECIFICATION

7 PRO 5845

9 8940HX

Core Specs

Cores

8

16 +100.0%

Threads

16

32 +100.0%

Base Clock (GHz)

3.4

2.4 -29.4%

Boost Clock (GHz)

4.6

5.3 +15.2%

Frequency (GHz)

3.4

2.4 -29.4%

Turbo Clock (GHz)

4.6

5.3 +15.2%

Multiplier

34

24 -29.4%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

32 MB (shared)

64 MB (shared)

Power

TDP (W)

65

55 -15.4%

PPT

88 W

—

Configurable TDP

—

45-75 W

Architecture

Architecture

Zen 3

Zen 4

Codename

Vermeer

Dragon Range

Generation

Ryzen 7 (Zen 3 (Vermeer))

Ryzen 9 (Zen 4 (Dragon Range))

Process Size

7 nm

5 nm

Transistors

4,150 million

13,140 million

Die Size

74 mm²

2x 71 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

DDR5

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

83.2 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket AM4

AMD Socket FL1

Chipsets

AMD 300 Series*, AMD 400 Series, AMD 500 Series

—

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 5, 28 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

6 nm

Graphics

Integrated Graphics

—

Radeon 610M

Other

Market

Desktop

Mobile

Production Status

Active

Active

Part Number

100-000000832

100-000001849

Package

µOPGA-1331

µFC-BGAFL1

Tj Max

—

100°C

Bundled Cooler

None

—

View Ryzen 7 PRO 5845 Details View Ryzen 9 8940HX Details