CPU Comparison

A

AMD

AMD

AMD Ryzen 3 4300G

CORE STATE Renoir

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 3.8 Base / 4 GHz Turbo

CACHE 4 MB (shared)

MAX TDP 65W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2020

VS

A

AMD

AMD

Ryzen 9 8940HX

CORE STATE Dragon Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.4 Base / 5.3 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

845

4,584

cinebench_cinebench_r15_singlecore

119

647

cinebench_cinebench_r20_multicore

3,522

19,104

cinebench_cinebench_r20_singlecore

497

2,696

cinebench_cinebench_r23_multicore

8,387

45,488

cinebench_cinebench_r23_singlecore

1,184

6,421

passmark_data_compression

137,681

738,673

passmark_data_encryption

8,176

44,430

passmark_extended_instructions

9,148

54,674

passmark_find_prime_numbers

20

272

passmark_floating_point_math

17,577

125,981

passmark_integer_math

29,737

205,945

passmark_multithread

9,849

54,675

passmark_physics

454

2,115

passmark_random_string_sorting

14,503

85,869

passmark_single_thread

2,425

4,033

passmark_singlethread

2,425

4,033

DETAILED SPECIFICATIONS

SPECIFICATION

3 4300G

9 8940HX

Core Specs

Cores

4

16 +300.0%

Threads

8

32 +300.0%

Base Clock (GHz)

3.8

2.4 -36.8%

Boost Clock (GHz)

4

5.3 +32.5%

Frequency (GHz)

3.8

2.4 -36.8%

Turbo Clock (GHz)

4

5.3 +32.5%

Multiplier

38

24 -36.8%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

4 MB (shared)

64 MB (shared)

Power

TDP (W)

65

55 -15.4%

PPT

61-88 W

—

Configurable TDP

45 W

45-75 W

Architecture

Architecture

Zen 2

Zen 4

Codename

Renoir

Dragon Range

Generation

Ryzen 3 (Zen 2 (Renoir))

Ryzen 9 (Zen 4 (Dragon Range))

Process Size

7 nm

5 nm

Transistors

9,800 million

13,140 million

Die Size

156 mm²

2x 71 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

DDR5

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

83.2 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket AM4

AMD Socket FL1

Chipsets

AMD 300 Series, AMD 400 Series, AMD 500 Series

—

PCIe

Gen 3, 16 Lanes(CPU only)

Gen 5, 28 Lanes(CPU only)

AMD Multi-Die

IO Process Size

—

6 nm

Graphics

Integrated Graphics

Radeon Vega 6

Radeon 610M

Other

Market

Desktop

Mobile

Production Status

Active

Active

Part Number

100-000000144

100-000001849

Package

µOPGA-1331

µFC-BGAFL1

Tj Max

95°C

100°C

View Ryzen 3 4300G Details View Ryzen 9 8940HX Details