CPU Comparison

AMD
AMD

AMD Ryzen 9 7950X3D

CORE STATE Raphael
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 4.2 Base / 5.7 GHz Turbo
CACHE 128 MB (shared)
MAX TDP 120W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
Intel
INTEL

Xeon Phi 7210

CORE STATE Knights Landing
CORE SPECS 64 Cores / 256 Threads
CLOCK SPEED 1300 Base / 1500 GHz Turbo
CACHE
MAX TDP 215W
ARCHITECTURE Knights Landing
nm
PROCESS 14 nm
LAUNCH DATE 2016

PERFORMANCE BENCHMARKS

3dmark_16_threads
13,180
N/A
3dmark_2_threads
2,102
N/A
3dmark_4_threads
4,123
N/A
3dmark_8_threads
7,641
N/A
3dmark_max_threads
14,252
N/A
3dmark_single_thread
1,062
N/A
cinebench_cinebench_r15_multicore
5,344
625
cinebench_cinebench_r15_singlecore
754
88
cinebench_cinebench_r20_multicore
22,269
2,608
cinebench_cinebench_r20_singlecore
3,143
367
cinebench_cinebench_r23_multicore
53,023
6,210
cinebench_cinebench_r23_singlecore
7,485
876
geekbench_multicore
19,663
N/A
geekbench_singlecore
2,926
N/A
passmark_data_compression
784,993
332,960
passmark_data_encryption
47,100
3,455
passmark_extended_instructions
58,515
18,359
passmark_find_prime_numbers
495
10
passmark_floating_point_math
130,403
29,356
passmark_integer_math
214,089
84,874
passmark_multithread
62,383
7,306
passmark_physics
5,053
198
passmark_random_string_sorting
92,784
8,956
passmark_single_thread
4,146
460
passmark_singlethread
4,146
460

DETAILED SPECIFICATIONS

SPECIFICATION
9 7950X3D
Phi 7210
Core Specs
Cores
16
64 +300.0%
Threads
32
256 +700.0%
Base Clock (GHz)
4.2
1,300 +30852.4%
Boost Clock (GHz)
5.7
1,500 +26215.8%
Frequency (GHz)
4.2
1,300 +30852.4%
Turbo Clock (GHz)
5.7
1,500 +26215.8%
Multiplier
42
13 -69.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
32 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
128 MB (shared)
3D V-Cache
1x 64MB Slice
Power
TDP (W)
120
215 +79.2%
PPT
162 W
Architecture
Architecture
Zen 4
Knights Landing
Codename
Raphael
Knights Landing
Generation
Ryzen 9 (Zen 4 (Raphael))
Xeon Phi (Knights Landing)
Process Size
5 nm
14 nm
Transistors
17,840 million
8,000 million
Die Size
2x 71 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Memory Bandwidth
83.2 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket AM5
Intel Socket 3647
Chipsets
X670E, X670, B650E, B650, A620
PCIe
Gen 5, 24 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Graphics
Integrated Graphics
Radeon Graphics
Other
Market
Desktop
Server/Workstation
Production Status
Active
Launch Price
$699
Part Number
100-000000908
SR2MESR2X4
Package
FC-LGA1718
FC-LGA3647
Tj Max
89°C
Bundled Cooler
None
View Ryzen 9 7950X3D Details View Xeon Phi 7210 Details