CPU Comparison

AMD
AMD

AMD Ryzen 9 7945HX3D

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.3 Base / 5.4 GHz Turbo
CACHE 128 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
Intel
INTEL

Core i9-11950H

CORE STATE Tiger Lake-H
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 2.1 Base / 5 GHz Turbo
CACHE 24 MB (shared)
MAX TDP 35W
ARCHITECTURE Tiger Lake
nm
PROCESS 10 nm
LAUNCH DATE 2021

PERFORMANCE BENCHMARKS

3dmark_16_threads
12,459
N/A
3dmark_2_threads
2,095
N/A
3dmark_4_threads
3,937
N/A
3dmark_8_threads
7,330
N/A
3dmark_max_threads
12,936
N/A
3dmark_single_thread
1,071
N/A
cinebench_cinebench_r15_multicore
4,922
1,790
cinebench_cinebench_r15_singlecore
694
252
cinebench_cinebench_r20_multicore
20,510
7,461
cinebench_cinebench_r20_singlecore
2,895
1,053
cinebench_cinebench_r23_multicore
48,834
17,765
cinebench_cinebench_r23_singlecore
6,894
2,508
geekbench_multicore
16,758
N/A
geekbench_singlecore
2,769
N/A
passmark_data_compression
699,988
246,195
passmark_data_encryption
42,367
12,658
passmark_extended_instructions
52,310
16,361
passmark_find_prime_numbers
446
93
passmark_floating_point_math
121,619
44,137
passmark_integer_math
201,217
74,649
passmark_multithread
57,476
20,900
passmark_physics
4,321
1,013
passmark_random_string_sorting
83,919
29,375
passmark_single_thread
4,050
3,141
passmark_singlethread
4,050
3,141

DETAILED SPECIFICATIONS

SPECIFICATION
9 7945HX3D
i9-11950H
Core Specs
Cores
16
8 -50.0%
Threads
32
16 -50.0%
Base Clock (GHz)
2.3
2.1 -8.7%
Boost Clock (GHz)
5.4
5 -7.4%
Frequency (GHz)
2.3
2.1 -8.7%
Turbo Clock (GHz)
5.4
5 -7.4%
Multiplier
23
21 -8.7%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1.25 MB (per core)
L3 Cache
128 MB (shared)
24 MB (shared)
3D V-Cache
1x 64MB Slice
—
Power
TDP (W)
55
35 -36.4%
PPT
55-75 W
—
Architecture
Architecture
Zen 4
Tiger Lake
Codename
Dragon Range
Tiger Lake-H
Generation
Ryzen 9 (Zen 4 (Dragon Range))
Core i9 (Tiger Lake-H)
Process Size
5 nm
10 nm
Transistors
17,840 million
—
Die Size
2x 71 mm²
190 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
83.2 GB/s
51.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket FL1
Intel BGA 1787
Chipsets
—
QM580, HM570, WM590
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
—
Graphics
Integrated Graphics
Radeon 610M
UHD Graphics 750
Other
Market
Mobile
Mobile
Production Status
Active
End-of-life
Launch Price
—
$556
Part Number
100-000001086
SRKT6
Package
µFC-BGAFL1
FC-BGA16F
Tj Max
100°C
100°C
View Ryzen 9 7945HX3D Details View Core i9-11950H Details