CPU Comparison
AMD
AMD Ryzen 5 230
CORE STATE
Hawk Point
CORE SPECS
6 Cores / 12 Threads
CLOCK SPEED
3.5 Base / 4.9 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
28W
ARCHITECTURE
Zen 4
PROCESS
4 nm
LAUNCH DATE
2025
VS
AMD
Ryzen 9 7945HX3D
CORE STATE
Dragon Range
CORE SPECS
16 Cores / 32 Threads
CLOCK SPEED
2.3 Base / 5.4 GHz Turbo
CACHE
128 MB (shared)
MAX TDP
55W
ARCHITECTURE
Zen 4
PROCESS
5 nm
LAUNCH DATE
2023
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
geekbench_multicore
geekbench_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
5 230
9 7945HX3D
Core Specs
Cores
6
16
+166.7%
Threads
12
32
+166.7%
Base Clock (GHz)
3.5
2.3
-34.3%
Boost Clock (GHz)
4.9
5.4
+10.2%
Frequency (GHz)
3.5
2.3
-34.3%
Turbo Clock (GHz)
4.9
5.4
+10.2%
Multiplier
35
23
-34.3%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
16 MB (shared)
128 MB (shared)
3D V-Cache
—
1x 64MB Slice
Power
TDP (W)
28
55
+96.4%
PPT
—
55-75 W
Configurable TDP
15-30 W
—
Architecture
Architecture
Zen 4
Zen 4
Codename
Hawk Point
Dragon Range
Generation
Ryzen 5
(Zen 4 (Hawk Point))
Ryzen 9
(Zen 4 (Dragon Range))
Process Size
4 nm
5 nm
Transistors
25,000 million
17,840 million
Die Size
178 mm²
2x 71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
83.2 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket FP8
AMD Socket FL1
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
—
6 nm
AI/NPU
XDNA NPU
16 TOPS
—
Graphics
Integrated Graphics
Radeon 760M
Radeon 610M
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000001726
100-000001086
Package
FP8, FP7, FP7r2
µFC-BGAFL1
Tj Max
100°C
100°C