CPU Comparison
AMD
AMD Ryzen 3 8440U
CORE STATE
Hawk Point
CORE SPECS
4 Cores / 8 Threads
CLOCK SPEED
3 Base / 4.7 GHz Turbo
CACHE
8 MB (shared)
MAX TDP
28W
ARCHITECTURE
Zen 4
PROCESS
4 nm
LAUNCH DATE
2023
VS
AMD
Ryzen 9 7940HX
CORE STATE
Dragon Range
CORE SPECS
16 Cores / 32 Threads
CLOCK SPEED
2.4 Base / 5.2 GHz Turbo
CACHE
64 MB (shared)
MAX TDP
55W
ARCHITECTURE
Zen 4
PROCESS
5 nm
LAUNCH DATE
2024
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
DETAILED SPECIFICATIONS
SPECIFICATION
3 8440U
9 7940HX
Core Specs
Cores
4
16
+300.0%
Threads
8
32
+300.0%
Base Clock (GHz)
3
2.4
-20.0%
Boost Clock (GHz)
4.7
5.2
+10.6%
Frequency (GHz)
3
2.4
-20.0%
Turbo Clock (GHz)
4.7
5.2
+10.6%
Multiplier
30
24
-20.0%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
8 MB (shared)
64 MB (shared)
Power
TDP (W)
28
55
+96.4%
Configurable TDP
15-30 W
55-75 W
Architecture
Architecture
Zen 4
Zen 4
Codename
Hawk Point
Dragon Range
Generation
Ryzen 3
(Zen 4 (Hawk Point))
Ryzen 9
(Zen 4 (Dragon Range))
Process Size
4 nm
5 nm
Transistors
20,900 million
13,140 million
Die Size
137 mm²
2x 71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
83.2 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket FP7
AMD Socket FL1
PCIe
Gen 4, 14 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
1 + 3
—
E-Core Frequency
2.8 GHz
up to 3.3 GHz
—
AMD Multi-Die
IO Process Size
—
6 nm
Graphics
Integrated Graphics
Radeon 740M
Radeon 610M
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000001325(FP7r2)100-000001332(FP7)
100-000001486
Package
FP7, FP7r2
µFC-BGAFL1
Tj Max
100°C
100°C