CPU Comparison

AMD
AMD

AMD Ryzen 9 7900X3D

CORE STATE Raphael
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 4.4 Base / 5.6 GHz Turbo
CACHE 128 MB (shared)
MAX TDP 120W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
Intel
INTEL

Xeon Phi 7210

CORE STATE Knights Landing
CORE SPECS 64 Cores / 256 Threads
CLOCK SPEED 1300 Base / 1500 GHz Turbo
CACHE
MAX TDP 215W
ARCHITECTURE Knights Landing
nm
PROCESS 14 nm
LAUNCH DATE 2016

PERFORMANCE BENCHMARKS

3dmark_16_threads
10,144
N/A
3dmark_2_threads
2,071
N/A
3dmark_4_threads
4,041
N/A
3dmark_8_threads
7,315
N/A
3dmark_max_threads
11,480
N/A
3dmark_single_thread
1,049
N/A
cinebench_cinebench_r15_multicore
4,310
625
cinebench_cinebench_r15_singlecore
608
88
cinebench_cinebench_r20_multicore
17,962
2,608
cinebench_cinebench_r20_singlecore
2,535
367
cinebench_cinebench_r23_multicore
42,767
6,210
cinebench_cinebench_r23_singlecore
6,037
876
geekbench_multicore
17,549
N/A
geekbench_singlecore
2,862
N/A
passmark_data_compression
593,838
332,960
passmark_data_encryption
35,293
3,455
passmark_extended_instructions
44,567
18,359
passmark_find_prime_numbers
445
10
passmark_floating_point_math
97,246
29,356
passmark_integer_math
160,779
84,874
passmark_multithread
50,317
7,306
passmark_physics
4,728
198
passmark_random_string_sorting
70,662
8,956
passmark_single_thread
4,126
460
passmark_singlethread
4,126
460

DETAILED SPECIFICATIONS

SPECIFICATION
9 7900X3D
Phi 7210
Core Specs
Cores
12
64 +433.3%
Threads
24
256 +966.7%
Base Clock (GHz)
4.4
1,300 +29445.5%
Boost Clock (GHz)
5.6
1,500 +26685.7%
Frequency (GHz)
4.4
1,300 +29445.5%
Turbo Clock (GHz)
5.6
1,500 +26685.7%
Multiplier
44
13 -70.5%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
32 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
128 MB (shared)
3D V-Cache
1x 64MB Slice
Power
TDP (W)
120
215 +79.2%
PPT
162 W
Architecture
Architecture
Zen 4
Knights Landing
Codename
Raphael
Knights Landing
Generation
Ryzen 9 (Zen 4 (Raphael))
Xeon Phi (Knights Landing)
Process Size
5 nm
14 nm
Transistors
17,840 million
8,000 million
Die Size
2x 71 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Memory Bandwidth
83.2 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket AM5
Intel Socket 3647
Chipsets
X670E, X670, B650E, B650, A620
PCIe
Gen 5, 24 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Graphics
Integrated Graphics
Radeon Graphics
Other
Market
Desktop
Server/Workstation
Production Status
Active
Launch Price
$599
Part Number
100-000000909
SR2MESR2X4
Package
FC-LGA1718
FC-LGA3647
Tj Max
89°C
Bundled Cooler
None
View Ryzen 9 7900X3D Details View Xeon Phi 7210 Details