CPU Comparison
AMD
AMD Ryzen 9 5900X
CORE STATE
Vermeer
CORE SPECS
12 Cores / 24 Threads
CLOCK SPEED
3.7 Base / 4.8 GHz Turbo
CACHE
64 MB
MAX TDP
105W
ARCHITECTURE
Zen 3
PROCESS
7 nm
LAUNCH DATE
2020
VS
INTEL
Core i7-11700F
CORE STATE
Rocket Lake
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
2.5 Base / 4.9 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
65W
ARCHITECTURE
Rocket Lake
PROCESS
14 nm
LAUNCH DATE
2021
PERFORMANCE BENCHMARKS
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
9 5900X
i7-11700F
Core Specs
Cores
12
8
-33.3%
Threads
24
16
-33.3%
Base Clock (GHz)
3.7
2.5
-32.4%
Boost Clock (GHz)
4.8
4.9
+2.1%
Frequency (GHz)
3.7
2.5
-32.4%
Turbo Clock (GHz)
4.8
4.9
+2.1%
Multiplier
37
25
-32.4%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
512 KB (per core)
L3 Cache
64 MB
16 MB (shared)
Power
TDP (W)
105
65
-38.1%
PPT
142 W
—
Architecture
Architecture
Zen 3
Rocket Lake
Codename
Vermeer
Rocket Lake
Generation
Ryzen 9
(Zen 3 (Vermeer))
Core i7
(Rocket Lake-S)
Process Size
7 nm
14 nm
Transistors
8,300 million
—
Die Size
2x 74 mm²
276 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
51.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket AM4
Intel Socket 1200
Chipsets
AMD 300 Series*, AMD 400 Series, AMD 500 Series
H510, B560, H570, Q570, W580, Z590, Q470, H470, W480, Z490
PCIe
Gen 4
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
—
Other
Market
Desktop
Desktop
Production Status
Active
End-of-life
Launch Price
$549
$298
Part Number
100-000000061
SRKNR
Package
µOPGA-1331
FC-LGA14A
Tj Max
—
100°C