CPU Comparison

A

AMD

AMD

AMD Ryzen 9 5900

CORE STATE Vermeer

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3 Base / 4.7 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2021

VS

i

Intel

INTEL

Core i7-10850H

CORE STATE Comet Lake-H

CORE SPECS 6 Cores / 12 Threads

CLOCK SPEED 2.7 Base / 5.1 GHz Turbo

CACHE 12 MB (shared)

MAX TDP 45W

ARCHITECTURE Comet Lake

nm

PROCESS 14 nm

LAUNCH DATE 2020

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,906

997

cinebench_cinebench_r15_singlecore

410

140

cinebench_cinebench_r20_multicore

12,110

4,155

cinebench_cinebench_r20_singlecore

1,709

586

cinebench_cinebench_r23_multicore

28,834

9,893

cinebench_cinebench_r23_singlecore

4,070

1,396

passmark_data_compression

411,453

165,882

passmark_data_encryption

26,247

3,890

passmark_extended_instructions

26,859

10,381

passmark_find_prime_numbers

213

41

passmark_floating_point_math

69,124

25,216

passmark_integer_math

128,641

39,919

passmark_multithread

33,969

11,643

passmark_physics

1,697

718

passmark_random_string_sorting

43,386

21,537

passmark_single_thread

3,439

2,668

passmark_singlethread

3,439

2,668

geekbench_multicore

N/A

5,396

geekbench_singlecore

N/A

1,457

DETAILED SPECIFICATIONS

SPECIFICATION

9 5900

i7-10850H

Core Specs

Cores

12

6 -50.0%

Threads

24

12 -50.0%

Base Clock (GHz)

3

2.7 -10.0%

Boost Clock (GHz)

4.7

5.1 +8.5%

Frequency (GHz)

3

2.7 -10.0%

Turbo Clock (GHz)

4.7

5.1 +8.5%

Multiplier

30

27 -10.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

256 KB (per core)

L3 Cache

64 MB

12 MB (shared)

Power

TDP (W)

65

45 -30.8%

PPT

88 W

—

Architecture

Architecture

Zen 3

Comet Lake

Codename

Vermeer

Comet Lake-H

Generation

Ryzen 9 (Zen 3 (Vermeer))

Core i7 (Comet Lake-H)

Process Size

7 nm

14 nm

Transistors

8,300 million

—

Die Size

2x 74 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

DDR4

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

46.9 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket AM4

Intel BGA 1440

Chipsets

AMD 300 Series*, AMD 400 Series, AMD 500 Series

—

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 3, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

—

Graphics

Integrated Graphics

—

UHD Graphics

Other

Market

Desktop

Mobile

Production Status

Active

Active

Part Number

100-000000062

SRH8P

Package

µOPGA-1331

FC-BGA1440

Tj Max

—

100°C

Bundled Cooler

None

—

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