CPU Comparison

A

AMD

AMD

AMD Ryzen 9 5900

CORE STATE Vermeer

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3 Base / 4.7 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2021

VS

A

AMD

AMD

Ryzen AI Max 390

CORE STATE Strix Halo

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.2 Base / 5 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,906

3,635

cinebench_cinebench_r15_singlecore

410

513

cinebench_cinebench_r20_multicore

12,110

15,146

cinebench_cinebench_r20_singlecore

1,709

2,138

cinebench_cinebench_r23_multicore

28,834

36,064

cinebench_cinebench_r23_singlecore

4,070

5,091

passmark_data_compression

411,453

493,517

passmark_data_encryption

26,247

25,692

passmark_extended_instructions

26,859

39,250

passmark_find_prime_numbers

213

322

passmark_floating_point_math

69,124

93,598

passmark_integer_math

128,641

148,707

passmark_multithread

33,969

42,429

passmark_physics

1,697

2,754

passmark_random_string_sorting

43,386

53,851

passmark_single_thread

3,439

4,025

passmark_singlethread

3,439

4,025

DETAILED SPECIFICATIONS

SPECIFICATION

9 5900

AI Max 390

Core Specs

Cores

12

12 0.0%

Threads

24

24 0.0%

Base Clock (GHz)

3

3.2 +6.7%

Boost Clock (GHz)

4.7

5 +6.4%

Frequency (GHz)

3

3.2 +6.7%

Turbo Clock (GHz)

4.7

5 +6.4%

Multiplier

30

32 +6.7%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

64 MB

64 MB (shared)

Power

TDP (W)

65

55 -15.4%

PPT

88 W

—

Configurable TDP

—

45-120 W

Architecture

Architecture

Zen 3

Zen 5

Codename

Vermeer

Strix Halo

Generation

Ryzen 9 (Zen 3 (Vermeer))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

7 nm

4 nm

Transistors

8,300 million

—

Die Size

2x 74 mm²

2x 70.6 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

51.2 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket AM4

AMD Socket FP11

Chipsets

AMD 300 Series*, AMD 400 Series, AMD 500 Series

—

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8050S

Other

Market

Desktop

Mobile

Production Status

Active

Active

Part Number

100-000000062

100-000001423

Package

µOPGA-1331

FC-BGA

Tj Max

—

100°C

Bundled Cooler

None

—

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