CPU Comparison

AMD
AMD

AMD Ryzen 7 PRO 5645

CORE STATE Vermeer
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 3.7 Base / 4.6 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 65W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2022
VS
Intel
INTEL

Xeon E-2374G

CORE STATE Rocket Lake-E
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3.7 Base / 5 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 80W
ARCHITECTURE Rocket Lake
nm
PROCESS 14 nm
LAUNCH DATE 2021

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
N/A
1,176
cinebench_cinebench_r15_singlecore
N/A
165
cinebench_cinebench_r20_multicore
N/A
4,900
cinebench_cinebench_r20_singlecore
N/A
691
cinebench_cinebench_r23_multicore
N/A
11,667
cinebench_cinebench_r23_singlecore
N/A
1,647

DETAILED SPECIFICATIONS

SPECIFICATION
7 PRO 5645
E-2374G
Core Specs
Cores
6
4 -33.3%
Threads
12
8 -33.3%
Base Clock (GHz)
3.7
3.7 0.0%
Boost Clock (GHz)
4.6
5 +8.7%
Frequency (GHz)
3.7
3.7 0.0%
Turbo Clock (GHz)
4.6
5 +8.7%
Multiplier
37
37 0.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
512 KB (per core)
L3 Cache
32 MB (shared)
8 MB (shared)
Power
TDP (W)
65
80 +23.1%
PPT
88 W
โ€”
Architecture
Architecture
Zen 3
Rocket Lake
Codename
Vermeer
Rocket Lake-E
Generation
Ryzen 5 (Zen 3 (Vermeer))
Xeon E (Rocket Lake-E)
Process Size
7 nm
14 nm
Transistors
4,150 million
โ€”
Die Size
74 mmยฒ
276 mmยฒ
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
51.2 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket AM4
Intel Socket 1200
Chipsets
AMD 300 Series*, AMD 400 Series, AMD 500 Series
C252, C256
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
โ€”
Graphics
Integrated Graphics
โ€”
UHD Graphics P750
Other
Market
Desktop
Server/Workstation
Production Status
Active
Active
Launch Price
โ€”
$334
Part Number
100-000000833
SRKN3
Package
ยตOPGA-1331
FC-LGA1200
Tj Max
โ€”
100ยฐC
Bundled Cooler
None
โ€”
View Ryzen 7 PRO 5645 Details View Xeon E-2374G Details