CPU Comparison

AMD
AMD

AMD Ryzen 7 PRO 3700

CORE STATE Matisse
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.6 Base / 4.4 GHz Turbo
CACHE 32 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
Intel
INTEL

Core i7-9750H

CORE STATE Coffee Lake-HR
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 2.6 Base / 4.5 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 45W
ARCHITECTURE Coffee Lake
nm
PROCESS 14 nm
LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,955
913
cinebench_cinebench_r15_singlecore
275
128
cinebench_cinebench_r20_multicore
8,146
3,808
cinebench_cinebench_r20_singlecore
1,149
537
cinebench_cinebench_r23_multicore
19,397
9,069
cinebench_cinebench_r23_singlecore
2,738
1,280
geekbench_multicore
N/A
4,981
geekbench_singlecore
N/A
1,361
passmark_data_compression
N/A
150,443
passmark_data_encryption
N/A
3,756
passmark_extended_instructions
N/A
9,187
passmark_find_prime_numbers
N/A
32
passmark_floating_point_math
N/A
23,343
passmark_integer_math
N/A
37,822
passmark_multithread
N/A
10,671
passmark_physics
N/A
670
passmark_random_string_sorting
N/A
19,862
passmark_single_thread
N/A
2,404
passmark_singlethread
N/A
2,404

DETAILED SPECIFICATIONS

SPECIFICATION
7 PRO 3700
i7-9750H
Core Specs
Cores
8
6 -25.0%
Threads
16
12 -25.0%
Base Clock (GHz)
3.6
2.6 -27.8%
Boost Clock (GHz)
4.4
4.5 +2.3%
Frequency (GHz)
3.6
2.6 -27.8%
Turbo Clock (GHz)
4.4
4.5 +2.3%
Multiplier
36
26 -27.8%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
32 MB
12 MB (shared)
Power
TDP (W)
65
45 -30.8%
PPT
88 W
Architecture
Architecture
Zen 2
Coffee Lake
Codename
Matisse
Coffee Lake-HR
Generation
Ryzen 7 (Zen 2 (Matisse))
Core i7 (Coffee Lake-HR)
Process Size
7 nm
14 nm
Transistors
3,800 million
Die Size
74 mm²
149 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
42.7 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket AM4
Intel BGA 1440
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 3
AMD Multi-Die
IO Process Size
12 nm
Graphics
Integrated Graphics
UHD 630
Other
Market
Desktop
Mobile
Production Status
Active
End-of-life
Part Number
100-000000073
SRF6USRFCP
Package
µOPGA-1331
FC-BGA1440
Tj Max
95°C
100°C
View Ryzen 7 PRO 3700 Details View Core i7-9750H Details