CPU Comparison
AMD
AMD Ryzen 7 7745HX
CORE STATE
Dragon Range
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3.6 Base / 5.1 GHz Turbo
CACHE
32 MB (shared)
MAX TDP
55W
ARCHITECTURE
Zen 4
PROCESS
5 nm
LAUNCH DATE
2023
VS
INTEL
Core i7-11700F
CORE STATE
Rocket Lake
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
2.5 Base / 4.9 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
65W
ARCHITECTURE
Rocket Lake
PROCESS
14 nm
LAUNCH DATE
2021
PERFORMANCE BENCHMARKS
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
7 7745HX
i7-11700F
Core Specs
Cores
8
8
0.0%
Threads
16
16
0.0%
Base Clock (GHz)
3.6
2.5
-30.6%
Boost Clock (GHz)
5.1
4.9
-3.9%
Frequency (GHz)
3.6
2.5
-30.6%
Turbo Clock (GHz)
5.1
4.9
-3.9%
Multiplier
36
25
-30.6%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
32 MB (shared)
16 MB (shared)
Power
TDP (W)
55
65
+18.2%
Configurable TDP
45-75 W
ā
Architecture
Architecture
Zen 4
Rocket Lake
Codename
Dragon Range
Rocket Lake
Generation
Ryzen 7
(Zen 4 (Dragon Range))
Core i7
(Rocket Lake-S)
Process Size
5 nm
14 nm
Transistors
6,570 million
ā
Die Size
71 mmĀ²
276 mmĀ²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
83.2 GB/s
51.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket FL1
Intel Socket 1200
Chipsets
ā
H510, B560, H570, Q570, W580, Z590, Q470, H470, W480, Z490
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
ā
Graphics
Integrated Graphics
Radeon 610M
ā
Other
Market
Mobile
Desktop
Production Status
Active
End-of-life
Launch Price
ā
$298
Part Number
100-000000721
SRKNR
Package
ĀµFC-BGAFL1
FC-LGA14A
Tj Max
100Ā°C
100Ā°C