CPU Comparison
AMD
AMD Ryzen 7 7745HX
CORE STATE
Dragon Range
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3.6 Base / 5.1 GHz Turbo
CACHE
32 MB (shared)
MAX TDP
55W
ARCHITECTURE
Zen 4
PROCESS
5 nm
LAUNCH DATE
2023
VS
AMD
Ryzen 9 PRO 5945
CORE STATE
Vermeer
CORE SPECS
12 Cores / 24 Threads
CLOCK SPEED
3 Base / 4.7 GHz Turbo
CACHE
64 MB
MAX TDP
65W
ARCHITECTURE
Zen 3
PROCESS
7 nm
LAUNCH DATE
2022
PERFORMANCE BENCHMARKS
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
7 7745HX
9 PRO 5945
Core Specs
Cores
8
12
+50.0%
Threads
16
24
+50.0%
Base Clock (GHz)
3.6
3
-16.7%
Boost Clock (GHz)
5.1
4.7
-7.8%
Frequency (GHz)
3.6
3
-16.7%
Turbo Clock (GHz)
5.1
4.7
-7.8%
Multiplier
36
30
-16.7%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
32 MB (shared)
64 MB
Power
TDP (W)
55
65
+18.2%
PPT
—
88 W
Configurable TDP
45-75 W
—
Architecture
Architecture
Zen 4
Zen 3
Codename
Dragon Range
Vermeer
Generation
Ryzen 7
(Zen 4 (Dragon Range))
Ryzen 9
(Zen 3 (Vermeer))
Process Size
5 nm
7 nm
Transistors
6,570 million
8,300 million
Die Size
71 mm²
2x 74 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
83.2 GB/s
51.2 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FL1
AMD Socket AM4
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
12 nm
Graphics
Integrated Graphics
Radeon 610M
—
Other
Market
Mobile
Desktop
Production Status
Active
Active
Part Number
100-000000721
100-000000831
Package
µFC-BGAFL1
µOPGA-1331
Tj Max
100°C
—
Bundled Cooler
—
None