CPU Comparison

A

AMD

AMD

AMD Ryzen 7 5825U

CORE STATE Barcelo

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 2000 Base / 4.5 GHz Turbo

CACHE 16 MB (shared)

MAX TDP 15W

ARCHITECTURE Zen 3

nm

PROCESS 7 nm

LAUNCH DATE 2022

VS

i

Intel

INTEL

Xeon Phi 7210

CORE STATE Knights Landing

CORE SPECS 64 Cores / 256 Threads

CLOCK SPEED 1300 Base / 1500 GHz Turbo

CACHE —

MAX TDP 215W

ARCHITECTURE Knights Landing

nm

PROCESS 14 nm

LAUNCH DATE 2016

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,553

625

cinebench_cinebench_r15_singlecore

219

88

cinebench_cinebench_r20_multicore

6,473

2,608

cinebench_cinebench_r20_singlecore

913

367

cinebench_cinebench_r23_multicore

15,413

6,210

cinebench_cinebench_r23_singlecore

2,175

876

geekbench_multicore

6,421

N/A

geekbench_singlecore

1,723

N/A

passmark_data_compression

221,938

332,960

passmark_data_encryption

14,088

3,455

passmark_extended_instructions

14,394

18,359

passmark_find_prime_numbers

48

10

passmark_floating_point_math

38,482

29,356

passmark_integer_math

72,577

84,874

passmark_multithread

18,131

7,306

passmark_physics

774

198

passmark_random_string_sorting

23,539

8,956

passmark_single_thread

3,053

460

passmark_singlethread

3,053

460

DETAILED SPECIFICATIONS

SPECIFICATION

7 5825U

Phi 7210

Core Specs

Cores

8

64 +700.0%

Threads

16

256 +1500.0%

Base Clock (GHz)

2,000

1,300 -35.0%

Boost Clock (GHz)

4.5

1,500 +33233.3%

Frequency (GHz)

2,000

1,300 -35.0%

Turbo Clock (GHz)

4.5

1,500 +33233.3%

Multiplier

20

13 -35.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

32 KB (per core)

L2 Cache

512 KB (per core)

512 KB (per core)

L3 Cache

16 MB (shared)

—

Power

TDP (W)

15

215 +1333.3%

Configurable TDP

25W

—

Architecture

Architecture

Zen 3

Knights Landing

Codename

Barcelo

Knights Landing

Generation

Ryzen 7 (Zen 3 (Cezanne))

Xeon Phi (Knights Landing)

Process Size

7 nm

14 nm

Transistors

10,700 million

8,000 million

Die Size

180 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

DDR4

DDR4

Memory Bus

Dual-channel

—

Memory Bandwidth

51.2 GB/s

—

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket FP6

Intel Socket 3647

PCIe

Gen 3, 16 Lanes(CPU only)

—

Graphics

Integrated Graphics

Radeon Vega 8

—

Other

Market

Mobile

Server/Workstation

Production Status

Active

—

Part Number

100-000000580

SR2MESR2X4

Package

FC-BGA1140

FC-LGA3647

Tj Max

95°C

—

View Ryzen 7 5825U Details View Xeon Phi 7210 Details