CPU Comparison
AMD
AMD Ryzen 7 5800X3D
CORE STATE
Vermeer
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3.4 Base / 4.5 GHz Turbo
CACHE
96 MB (shared)
MAX TDP
105W
ARCHITECTURE
Zen 3
PROCESS
7 nm
LAUNCH DATE
2022
VS
AMD
Ryzen AI Max 385
CORE STATE
Strix Halo
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3.6 Base / 5 GHz Turbo
CACHE
32 MB (shared)
MAX TDP
55W
ARCHITECTURE
Zen 5
PROCESS
4 nm
LAUNCH DATE
2025
PERFORMANCE BENCHMARKS
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
7 5800X3D
AI Max 385
Core Specs
Cores
8
8
0.0%
Threads
16
16
0.0%
Base Clock (GHz)
3.4
3.6
+5.9%
Boost Clock (GHz)
4.5
5
+11.1%
Frequency (GHz)
3.4
3.6
+5.9%
Turbo Clock (GHz)
4.5
5
+11.1%
Multiplier
34
36
+5.9%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
96 MB (shared)
32 MB (shared)
Power
TDP (W)
105
55
-47.6%
PPT
142 W
โ
Configurable TDP
โ
45-120 W
Architecture
Architecture
Zen 3
Zen 5
Codename
Vermeer
Strix Halo
Generation
Ryzen 7
(Zen 3 (Vermeer))
Ryzen AI Max
(Zen 5 (Strix Halo))
Process Size
7 nm
4 nm
Transistors
8,850 million
โ
Die Size
74 mmยฒ
2x 70.6 mmยฒ
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
LPDDR5X
Memory Bus
Dual-channel
Quad-channel
Memory Bandwidth
51.2 GB/s
256.0 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket AM4
AMD Socket FP11
Chipsets
AMD 300 Series*, AMD 400 Series, AMD 500 Series
โ
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
โ
AI/NPU
NPU
โ
Yes /
50 TOPS
Graphics
Integrated Graphics
โ
Radeon 8050S
Other
Market
Desktop
Mobile
Production Status
End-of-life
Active
Launch Price
$449
โ
Part Number
100-000000651
100-000001424
Package
ยตOPGA-1331
FC-BGA
Tj Max
โ
100ยฐC