CPU Comparison

AMD
AMD

AMD Ryzen 7 5700X3D

CORE STATE Vermeer
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3 Base / 4.1 GHz Turbo
CACHE 96 MB (shared)
MAX TDP 105W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2024
VS
AMD
AMD

Ryzen 9 8940HX

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.4 Base / 5.3 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

3dmark_16_threads
6,764
N/A
3dmark_2_threads
1,575
N/A
3dmark_4_threads
3,097
N/A
3dmark_8_threads
5,357
N/A
3dmark_max_threads
6,755
N/A
3dmark_single_thread
804
N/A
cinebench_cinebench_r15_multicore
2,254
4,584
cinebench_cinebench_r15_singlecore
318
647
cinebench_cinebench_r20_multicore
9,393
19,104
cinebench_cinebench_r20_singlecore
1,325
2,696
cinebench_cinebench_r23_multicore
22,366
45,488
cinebench_cinebench_r23_singlecore
3,157
6,421
geekbench_multicore
10,108
N/A
geekbench_singlecore
1,922
N/A
passmark_data_compression
307,237
738,673
passmark_data_encryption
18,788
44,430
passmark_extended_instructions
21,202
54,674
passmark_find_prime_numbers
224
272
passmark_floating_point_math
46,492
125,981
passmark_integer_math
81,257
205,945
passmark_multithread
26,318
54,675
passmark_physics
2,686
2,115
passmark_random_string_sorting
31,492
85,869
passmark_single_thread
2,970
4,033
passmark_singlethread
2,970
4,033

DETAILED SPECIFICATIONS

SPECIFICATION
7 5700X3D
9 8940HX
Core Specs
Cores
8
16 +100.0%
Threads
16
32 +100.0%
Base Clock (GHz)
3
2.4 -20.0%
Boost Clock (GHz)
4.1
5.3 +29.3%
Frequency (GHz)
3
2.4 -20.0%
Turbo Clock (GHz)
4.1
5.3 +29.3%
Multiplier
30
24 -20.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
96 MB (shared)
64 MB (shared)
Power
TDP (W)
105
55 -47.6%
PPT
142 W
Configurable TDP
45-75 W
Architecture
Architecture
Zen 3
Zen 4
Codename
Vermeer
Dragon Range
Generation
Ryzen 7 (Zen 3 (Vermeer))
Ryzen 9 (Zen 4 (Dragon Range))
Process Size
7 nm
5 nm
Transistors
8,850 million
13,140 million
Die Size
74 mm²
2x 71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
83.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket AM4
AMD Socket FL1
Chipsets
AMD 300 Series*, AMD 400 Series, AMD 500 Series
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
6 nm
Graphics
Integrated Graphics
Radeon 610M
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$249
Part Number
100-000001503100-100001503WOF
100-000001849
Package
µOPGA-1331
µFC-BGAFL1
Tj Max
90°C
100°C
Bundled Cooler
None
View Ryzen 7 5700X3D Details View Ryzen 9 8940HX Details