CPU Comparison

AMD
AMD

AMD Ryzen 7 2700

CORE STATE Zen
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.2 Base / 4.1 GHz Turbo
CACHE 16 MB (shared)
MAX TDP 65W
ARCHITECTURE Zen
nm
PROCESS 12 nm
LAUNCH DATE 2018
VS
Intel
INTEL

Mobile Pentium III 1000

CORE STATE Coppermine
CORE SPECS 1 Cores / 1 Threads
CLOCK SPEED 1000 Base
CACHE —
MAX TDP 25W
ARCHITECTURE P6
nm
PROCESS 180 nm
LAUNCH DATE 2001

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,341
N/A
cinebench_cinebench_r15_singlecore
189
N/A
cinebench_cinebench_r20_multicore
5,589
N/A
cinebench_cinebench_r20_singlecore
788
N/A
cinebench_cinebench_r23_multicore
13,308
N/A
cinebench_cinebench_r23_singlecore
1,878
N/A

DETAILED SPECIFICATIONS

SPECIFICATION
7 2700
Mobile Pentium III 1000
Core Specs
Cores
8
1 -87.5%
Threads
16
1 -93.8%
Base Clock (GHz)
3.2
1,000 +31150.0%
Boost Clock (GHz)
4.1
—
Frequency (GHz)
3.2
1,000 +31150.0%
Turbo Clock (GHz)
4.1
—
Multiplier
32
10 -68.8%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
96 KB (per core)
32 KB
L2 Cache
512 KB (per core)
256 KB
L3 Cache
16 MB (shared)
—
Power
TDP (W)
65
25 -61.5%
Architecture
Architecture
Zen
P6
Codename
Zen
Coppermine
Generation
Ryzen 7 (Zen+ (Pinnacle Ridge))
Pentium III (Coppermine)
Process Size
12 nm
180 nm
Transistors
4,800 million
28 million
Die Size
213 mm²
106 mm²
Foundry
GlobalFoundries
Intel
Memory
Memory Support
DDR4
unknown Depends on motherboard
Memory Bus
Dual-channel
Single-channel
Memory Bandwidth
46.9 GB/s
—
ECC Memory
No
No
Platform
Socket
AMD Socket AM4
Intel Micro-BGA2
Chipsets
AMD 300 Series, AMD 400 Series, AMD 500 Series
—
PCIe
Gen 3, 16 Lanes(CPU only)
—
Graphics
Integrated Graphics
—
On certain motherboards (Chipset feature)
Other
Market
Desktop
Mobile
Production Status
Active
End-of-life
Launch Price
$299
$722
Part Number
YD2700BBM88AF
SL54FSL5TB
Package
µOPGA-1331
H-PBGA495
Tj Max
95°C
100°C
View Ryzen 7 2700 Details View Mobile Pentium III 1000 Details