CPU Comparison
AMD
AMD Ryzen 7 250
CORE STATE
Hawk Point
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3.3 Base / 5.1 GHz Turbo
CACHE
16 MB (shared)
MAX TDP
28W
ARCHITECTURE
Zen 4
PROCESS
4 nm
LAUNCH DATE
2025
VS
AMD
Ryzen 7 5700X3D
CORE STATE
Vermeer
CORE SPECS
8 Cores / 16 Threads
CLOCK SPEED
3 Base / 4.1 GHz Turbo
CACHE
96 MB (shared)
MAX TDP
105W
ARCHITECTURE
Zen 3
PROCESS
7 nm
LAUNCH DATE
2024
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
3dmark_16_threads
3dmark_2_threads
3dmark_4_threads
3dmark_8_threads
3dmark_max_threads
3dmark_single_thread
geekbench_multicore
geekbench_singlecore
DETAILED SPECIFICATIONS
SPECIFICATION
7 250
7 5700X3D
Core Specs
Cores
8
8
0.0%
Threads
16
16
0.0%
Base Clock (GHz)
3.3
3
-9.1%
Boost Clock (GHz)
5.1
4.1
-19.6%
Frequency (GHz)
3.3
3
-9.1%
Turbo Clock (GHz)
5.1
4.1
-19.6%
Multiplier
33
30
-9.1%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
16 MB (shared)
96 MB (shared)
Power
TDP (W)
28
105
+275.0%
PPT
ā
142 W
Configurable TDP
15-30 W
ā
Architecture
Architecture
Zen 4
Zen 3
Codename
Hawk Point
Vermeer
Generation
Ryzen 7
(Zen 4 (Hawk Point))
Ryzen 7
(Zen 3 (Vermeer))
Process Size
4 nm
7 nm
Transistors
25,000 million
8,850 million
Die Size
178 mm²
74 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
51.2 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket FP8
AMD Socket AM4
Chipsets
ā
AMD 300 Series*, AMD 400 Series, AMD 500 Series
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
ā
12 nm
AI/NPU
XDNA NPU
16 TOPS
ā
Graphics
Integrated Graphics
Radeon 780M
ā
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
ā
$249
Part Number
100-000001722
100-000001503100-100001503WOF
Package
FP8, FP7, FP7r2
µOPGA-1331
Tj Max
100°C
90°C
Bundled Cooler
ā
None