CPU Comparison
AMD
AMD Ryzen 5 7645HX
CORE STATE
Dragon Range
CORE SPECS
6 Cores / 12 Threads
CLOCK SPEED
4 Base / 5 GHz Turbo
CACHE
32 MB (shared)
MAX TDP
45W
ARCHITECTURE
Zen 4
PROCESS
5 nm
LAUNCH DATE
2023
VS
INTEL
Core Ultra 5 225H
CORE STATE
Arrow Lake-H
CORE SPECS
14 Cores / 14 Threads
CLOCK SPEED
1700 Base / 4.9 GHz Turbo
CACHE
18 MB (shared)
MAX TDP
28W
ARCHITECTURE
Arrow Lake
PROCESS
3 nm
LAUNCH DATE
2025
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
geekbench_multicore
geekbench_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
5 7645HX
Ultra 5 225H
Core Specs
Cores
6
14
+133.3%
Threads
12
14
+16.7%
Base Clock (GHz)
4
1,700
+42400.0%
Boost Clock (GHz)
5
4.9
-2.0%
Frequency (GHz)
4
1,700
+42400.0%
Turbo Clock (GHz)
5
4.9
-2.0%
Multiplier
40
17
-57.5%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
192 KB (per core)
L2 Cache
1 MB (per core)
3 MB (per core)
L3 Cache
32 MB (shared)
18 MB (shared)
Power
TDP (W)
45
28
-37.8%
PL1
โ
28 W
PL2
โ
60 W
Configurable TDP
75 W
โ
Architecture
Architecture
Zen 4
Arrow Lake
Codename
Dragon Range
Arrow Lake-H
Generation
Ryzen 5
(Zen 4 (Dragon Range))
Ultra 5
(Arrow Lake-H)
Process Size
5 nm
3 nm
Transistors
6,570 million
โ
Die Size
71 mmยฒ
โ
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5, LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
83.2 GB/s
102.4 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket FL1
Intel BGA 2049
Chipsets
โ
WM880, HM870
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 5, 8 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
โ
P-Cores: 4
E-Cores: 10
E-Core Frequency
โ
1300 MHz
up to 4.3 GHz
LP E-Cores
โ
2
AMD Multi-Die
IO Process Size
6 nm
โ
AI/NPU
NPU
โ
Yes /
13 TOPS
Graphics
Integrated Graphics
Radeon 610M
Arc Graphics 130T
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000000872
SRQAM
Package
ยตFC-BGAFL1
FC-BGA
Tj Max
100ยฐC
110ยฐC