CPU Comparison

AMD
AMD

AMD Ryzen 3 7335U

CORE STATE Rembrandt-R
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3 Base / 4.3 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 28W
ARCHITECTURE Zen 3+
nm
PROCESS 6 nm
LAUNCH DATE 2023
VS
AMD
AMD

Ryzen 5 7645HX

CORE STATE Dragon Range
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 4 Base / 5 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 45W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2023

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,078
2,268
cinebench_cinebench_r15_singlecore
152
320
cinebench_cinebench_r20_multicore
4,495
9,451
cinebench_cinebench_r20_singlecore
634
1,334
cinebench_cinebench_r23_multicore
10,703
22,504
cinebench_cinebench_r23_singlecore
1,511
3,177
passmark_data_compression
146,309
302,256
passmark_data_encryption
9,335
17,900
passmark_extended_instructions
10,314
22,969
passmark_find_prime_numbers
36
178
passmark_floating_point_math
24,298
48,798
passmark_integer_math
42,493
77,432
passmark_multithread
12,592
26,476
passmark_physics
647
1,497
passmark_random_string_sorting
15,361
34,434
passmark_single_thread
3,053
3,907
passmark_singlethread
3,053
3,907
geekbench_multicore
N/A
11,586
geekbench_singlecore
N/A
2,657

DETAILED SPECIFICATIONS

SPECIFICATION
3 7335U
5 7645HX
Core Specs
Cores
4
6 +50.0%
Threads
8
12 +50.0%
Base Clock (GHz)
3
4 +33.3%
Boost Clock (GHz)
4.3
5 +16.3%
Frequency (GHz)
3
4 +33.3%
Turbo Clock (GHz)
4.3
5 +16.3%
Multiplier
30
40 +33.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
8 MB (shared)
32 MB (shared)
Power
TDP (W)
28
45 +60.7%
Configurable TDP
75 W
Architecture
Architecture
Zen 3+
Zen 4
Codename
Rembrandt-R
Dragon Range
Generation
Ryzen 3 (Zen 3+ (Rembrandt))
Ryzen 5 (Zen 4 (Dragon Range))
Process Size
6 nm
5 nm
Transistors
6,570 million
Die Size
208 mm²
71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
76.8 GB/s
83.2 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FP7
AMD Socket FL1
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Graphics
Integrated Graphics
Radeon 660M
Radeon 610M
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000000537(FP7)100-000000549(FP7r2)
100-000000872
Package
FP7, FP7r2
µFC-BGAFL1
Tj Max
95°C
100°C
View Ryzen 3 7335U Details View Ryzen 5 7645HX Details