CPU Comparison

AMD
AMD

AMD Ryzen 3 4300G

CORE STATE Renoir
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3.8 Base / 4 GHz Turbo
CACHE 4 MB (shared)
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2020
VS
AMD
AMD

Ryzen 5 7645HX

CORE STATE Dragon Range
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 4 Base / 5 GHz Turbo
CACHE 32 MB (shared)
MAX TDP 45W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2023

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
845
2,268
cinebench_cinebench_r15_singlecore
119
320
cinebench_cinebench_r20_multicore
3,522
9,451
cinebench_cinebench_r20_singlecore
497
1,334
cinebench_cinebench_r23_multicore
8,387
22,504
cinebench_cinebench_r23_singlecore
1,184
3,177
passmark_data_compression
137,681
302,256
passmark_data_encryption
8,176
17,900
passmark_extended_instructions
9,148
22,969
passmark_find_prime_numbers
20
178
passmark_floating_point_math
17,577
48,798
passmark_integer_math
29,737
77,432
passmark_multithread
9,849
26,476
passmark_physics
454
1,497
passmark_random_string_sorting
14,503
34,434
passmark_single_thread
2,425
3,907
passmark_singlethread
2,425
3,907
geekbench_multicore
N/A
11,586
geekbench_singlecore
N/A
2,657

DETAILED SPECIFICATIONS

SPECIFICATION
3 4300G
5 7645HX
Core Specs
Cores
4
6 +50.0%
Threads
8
12 +50.0%
Base Clock (GHz)
3.8
4 +5.3%
Boost Clock (GHz)
4
5 +25.0%
Frequency (GHz)
3.8
4 +5.3%
Turbo Clock (GHz)
4
5 +25.0%
Multiplier
38
40 +5.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
4 MB (shared)
32 MB (shared)
Power
TDP (W)
65
45 -30.8%
PPT
61-88 W
Configurable TDP
45 W
75 W
Architecture
Architecture
Zen 2
Zen 4
Codename
Renoir
Dragon Range
Generation
Ryzen 3 (Zen 2 (Renoir))
Ryzen 5 (Zen 4 (Dragon Range))
Process Size
7 nm
5 nm
Transistors
9,800 million
6,570 million
Die Size
156 mm²
71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
83.2 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket AM4
AMD Socket FL1
Chipsets
AMD 300 Series, AMD 400 Series, AMD 500 Series
PCIe
Gen 3, 16 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
Graphics
Integrated Graphics
Radeon Vega 6
Radeon 610M
Other
Market
Desktop
Mobile
Production Status
Active
Active
Part Number
100-000000144
100-000000872
Package
µOPGA-1331
µFC-BGAFL1
Tj Max
95°C
100°C
View Ryzen 3 4300G Details View Ryzen 5 7645HX Details