CPU Comparison

AMD
AMD

AMD Ryzen 3 PRO 7330U

CORE STATE Barcelo-R
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 2.3 Base / 4.3 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 15W
ARCHITECTURE Zen 3
nm
PROCESS 7 nm
LAUNCH DATE 2023
VS
Intel
INTEL

Xeon E-2334

CORE STATE Rocket Lake-E
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3.4 Base / 4.8 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 65W
ARCHITECTURE Rocket Lake
nm
PROCESS 14 nm
LAUNCH DATE 2021

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,068
1,041
cinebench_cinebench_r15_singlecore
150
146
cinebench_cinebench_r20_multicore
4,454
4,339
cinebench_cinebench_r20_singlecore
628
612
cinebench_cinebench_r23_multicore
10,605
10,333
cinebench_cinebench_r23_singlecore
1,497
1,458
geekbench_multicore
4,532
N/A
geekbench_singlecore
1,573
N/A

Analysis: AMD Ryzen 3 PRO 7330U vs Intel Xeon E-2334

The Intel Xeon E-2334 and AMD Ryzen 3 PRO 7330U are both 4-core, 8-thread processors, but they target entirely different market segments: one is a server/workstation part on a desktop socket, the other a mobile chip. The benchmark data reveals a consistent, albeit narrow, pattern of performance leadership for the AMD part, despite the Intel chip’s higher clock speeds and newer PCIe generation. This analysis examines the head-to-head results, architectural differences, and the implications for potential use cases.

Head-to-Head Benchmarks

The AMD Ryzen 3 PRO 7330U wins all six benchmark comparisons in the data set, yet the margins are remarkably slim. The largest single-core advantage comes in the Cinebench R15 test, where the AMD chip scores 150 against the Intel’s 146, a delta of -2.7% from the perspective of the Intel part. This pattern holds across every Cinebench iteration: the AMD processor leads by roughly 2.5% to 2.7% in both single-core and multi-core workloads. For instance, in Cinebench R23 multi-core, the AMD scores 10,605 versus Intel’s 10,333, a -2.6% delta. Similarly, in the single-core R23 test, AMD’s 1,497 edges out Intel’s 1,458 by -2.6%.

The consistency is striking. In Cinebench R15, R20, and R23, the delta never exceeds -2.7% and never drops below -2.5%. This uniformity suggests the AMD chip’s advantage is not workload-specific but rather a fundamental per-clock efficiency lead. The Intel Xeon E-2334 has a significantly higher boost clock of 4.80 GHz compared to the AMD’s 4.30 GHz, yet it still trails. This implies the Zen 3 architecture in the AMD is executing more instructions per clock. Interestingly, the AMD also wins the multi-core tests by the same margin as the single-core tests, indicating that the 4-core/8-thread configuration scales identically on both platforms, with no thermal or power throttling affecting the mobile part’s results in these benchmarks.

When looking at the aggregate average benchmark score, the gap widens slightly. The AMD Ryzen 3 PRO 7330U holds an average score of 3,063, placing it in the 52nd percentile of all CPUs. The Intel Xeon E-2334 has an average of 2,988, also in the 52nd percentile. The AMD’s nearest rival is the Intel Xeon E5-2618L v3, with a delta of -0.1%, while the Intel’s closest competitor is the AMD Ryzen 5 PRO 5675U, with a delta of 0%. This data shows that despite the head-to-head loss, both processors occupy a similar performance tier globally, sitting near the median of all CPUs.

Architecture Differences

The most profound architectural divergence lies in the manufacturing process and core design. The Intel Xeon E-2334 is built on a 14 nm process at Intel’s foundry, with a die size of 276 mm². In contrast, the AMD Ryzen 3 PRO 7330U uses TSMC’s 7 nm process, packing 10,700 million transistors onto a much smaller 180 mm² die. This process advantage is the likely root cause of the AMD’s superior efficiency, allowing it to achieve competitive performance at a fraction of the power draw. The Intel chip carries a 65 W TDP, while the AMD is rated at just 15 W, a four-fold difference that underscores the mobile versus server/workstation design philosophies.

The core architectures are also distinct generations. Intel uses the Rocket Lake-E core, a derivative of its desktop Rocket Lake architecture, while AMD employs Zen 3, codenamed Barcelo-R. Both have 4 cores and 8 threads, but the cache layouts differ. The Intel provides 80 KB of L1 cache per core, while the AMD offers 64 KB per core. Both share 512 KB of L2 per core and 8 MB of shared L3, but the Intel’s larger L1 may not be enough to offset the Zen 3’s efficiency gains. The memory controllers are identical in specification, both supporting dual-channel DDR4 with a bandwidth of 51.2 GB/s and ECC memory, which is unusual for a mobile part but present in both.

Connectivity represents a significant split. The Intel Xeon E-2334 supports PCIe Gen 4 with 20 lanes (CPU only), while the AMD Ryzen 3 PRO 7330U is limited to PCIe Gen 3 with 16 lanes. This makes the Intel platform more suitable for modern high-bandwidth expansion cards. However, the AMD counteracts this with integrated Radeon Graphics (Vega 6), whereas the Intel Xeon E-2334 has no integrated graphics listed. This single feature fundamentally changes the system requirements: the Intel chip mandates a discrete GPU, while the AMD can operate in a slim, fanless chassis or ultraportable laptop without any additional graphics hardware.

The Verdict

The data indicates a clear, though narrow, victory for the AMD Ryzen 3 PRO 7330U in raw computational benchmarks. It outperforms the Intel Xeon E-2334 in every single test, with margins between 2.5% and 2.7%. This is particularly notable given the Intel’s higher boost clock of 4.80 GHz versus the AMD’s 4.30 GHz. The AMD achieves this with a 15 W TDP compared to Intel’s 65 W, suggesting a dramatic efficiency advantage that is not reflected in the scores alone.

From a pure performance standpoint, the AMD Ryzen 3 PRO 7330U is the faster processor. However, the Xeon E-2334 is not without merit. It offers PCIe Gen 4 support, which the AMD lacks, and its 20 lanes provide more expansion bandwidth for server/workstation tasks. The Intel part also has a launch MSRP of $250, but its market segment is explicitly Server/Workstation, whereas the AMD is classified as Mobile. The choice between them is less about raw speed and more about platform suitability. For a system requiring PCIe Gen 4 and a discrete GPU, the Intel Xeon E-2334 is the logical choice. For an integrated, power-sipping mobile solution, the AMD Ryzen 3 PRO 7330U is the only viable option based on this data.

Specification Differences

  • Manufacturer: Intel versus AMD
  • Socket: Intel Socket 1200 versus AMD Socket FP6
  • Architecture: Rocket Lake versus Zen 3
  • Codename: Rocket Lake-E versus Barcelo-R
  • Process Node: 14 nm (Intel foundry) versus 7 nm (TSMC foundry)
  • Transistors: Not listed for Intel versus 10,700 million for AMD
  • Die Size: 276 mm² versus 180 mm²
  • Base Clock: 3.40 GHz versus 2.30 GHz
  • Boost Clock: 4.80 GHz versus 4.30 GHz
  • TDP: 65 W versus 15 W
  • L1 Cache: 80 KB (per core) versus 64 KB (per core)
  • PCIe: Gen 4, 20 Lanes (CPU only) versus Gen 3, 16 Lanes (CPU only)
  • Integrated Graphics: None versus Radeon Graphics (Vega 6)
  • Market Segment: Server/Workstation versus Mobile
  • Release Date: 2021-09-07 versus 2023-01-03
  • Launch MSRP: $250 versus not listed
  • Part Number: SRKN6 versus 100-000000950

FAQ

Q: Which processor is faster in multi-core workloads?

A: The AMD Ryzen 3 PRO 7330U wins all multi-core tests. In Cinebench R23 multi-core, it scores 10,605 versus the Intel Xeon E-2334’s 10,333, a delta of -2.6%.

Q: Does the Intel Xeon E-2334 have integrated graphics?

A: No, the Intel Xeon E-2334 has no integrated graphics listed. The AMD Ryzen 3 PRO 7330U includes Radeon Graphics (Vega 6).

Q: What is the TDP difference between the two?

A: The Intel Xeon E-2334 has a TDP of 65 W, while the AMD Ryzen 3 PRO 7330U has a TDP of 15 W.

Q: Which processor supports PCIe Gen 4?

A: The Intel Xeon E-2334 supports PCIe Gen 4 with 20 lanes (CPU only). The AMD Ryzen 3 PRO 7330U supports PCIe Gen 3 with 16 lanes (CPU only).

Q: What is the average benchmark score for each processor?

A: The Intel Xeon E-2334 has an average benchmark score of 2,988, and the AMD Ryzen 3 PRO 7330U has an average score of 3,063. Both sit in the 52nd percentile of all CPUs.

Q: Are the memory bandwidth specifications identical?

A: Yes, both support dual-channel DDR4 with a memory bandwidth of 51.2 GB/s and support ECC memory.

Where Each One Wins

The AMD Ryzen 3 PRO 7330U wins exclusively in computational benchmarks. It outperforms the Intel Xeon E-2334 in every Cinebench test, from R15 single-core (150 vs 146) to R23 multi-core (10,605 vs 10,333). This makes it the better choice for any CPU-bound task that relies on single-threaded or multi-threaded performance, from office productivity to rendering. Its 15 W TDP also makes it the only viable option for fanless or battery-operated mobile systems, and its integrated Radeon Graphics eliminate the need for a separate GPU.

The Intel Xeon E-2334 wins on platform features despite losing every benchmark. Its PCIe Gen 4 support with 20 lanes provides a superior foundation for high-speed storage and expansion cards, which is critical for server and workstation applications. The larger 80 KB L1 cache per core may benefit specific cache-sensitive workloads, though the benchmark data does not reflect this. Its 65 W TDP and Socket 1200 platform are designed for sustained, multi-year operation in a desktop or server chassis, and it carries a launch MSRP of $250, indicating a direct-market positioning. The data strongly suggests that the AMD is the faster CPU, but the Intel is the more capable platform for PCIe Gen 4 expansion.

DETAILED SPECIFICATIONS

SPECIFICATION
3 PRO 7330U
E-2334
Core Specs
Cores
4
4 0.0%
Threads
8
8 0.0%
Base Clock (GHz)
2.3
3.4 +47.8%
Boost Clock (GHz)
4.3
4.8 +11.6%
Frequency (GHz)
2.3
3.4 +47.8%
Turbo Clock (GHz)
4.3
4.8 +11.6%
Multiplier
23
34 +47.8%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
512 KB (per core)
L3 Cache
8 MB (shared)
8 MB (shared)
Power
TDP (W)
15
65 +333.3%
Architecture
Architecture
Zen 3
Rocket Lake
Codename
Barcelo-R
Rocket Lake-E
Generation
Ryzen 3 (Zen 3 (Cezanne))
Xeon E (Rocket Lake-E)
Process Size
7 nm
14 nm
Transistors
10,700 million
Die Size
180 mm²
276 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
51.2 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket FP6
Intel Socket 1200
Chipsets
C252, C256
PCIe
Gen 3, 16 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
Graphics
Integrated Graphics
Radeon Graphics (Vega 6)
Other
Market
Mobile
Server/Workstation
Production Status
Active
Active
Launch Price
$250
Part Number
100-000000950
SRKN6
Package
FP6
FC-LGA1200
Tj Max
95°C
100°C
View Ryzen 3 PRO 7330U Details View Xeon E-2334 Details